Patents by Inventor Magali Lambert

Magali Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor chip and method of manufacturing the same
    Patent number: 8821794
    Abstract: A sensor chip (100) for detecting particles, the sensor chip (100) comprising a substrate (102), an electric connection structure (104) arranged in a surface portion of the substrate (102) and adapted for an electric connection to an electric connection element (106), a sensor active region (108) arranged in another surface portion of the substrate (102) and being sensitive to the presence of the particles to be detected, and a continuous dielectric layer (110) covering the substrate (102) including covering the electric connection structure (104) and the sensor active region (108).
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: September 2, 2014
    Assignee: NXP, B.V.
    Inventors: Evelyne Gridelet, Franciscus Widdershoven, Pablo Garcia Tello, Magali Lambert
  • Integrated circuit with grating and manufacturing method therefor
    Patent number: 8450823
    Abstract: Disclosed is an integrated circuit (100) comprising a substrate (110) carrying a plurality of light-sensitive elements (112) and a blazed grating (120) comprising a plurality of diffractive elements (122) for diffracting respective spectral components (123-125) of incident light (150) to respective light-sensitive elements (112), the blazed grating (120) comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions (202, 222, 242) arranged such that each diffractive element (122) comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.
    Type: Grant
    Filed: September 12, 2009
    Date of Patent: May 28, 2013
    Assignee: NXP B.V.
    Inventors: Erwin Hijzen, Magali Lambert
  • INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR
    Publication number: 20110169120
    Abstract: Disclosed is an integrated circuit (100) comprising a substrate (110) carrying a plurality of light-sensitive elements (112) and a blazed grating (120) comprising a plurality of diffractive elements (122) for diffracting respective spectral components (123-125) of incident light (150) to respective light-sensitive elements (112), the blazed grating (120) comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions (202, 222, 242) arranged such that each diffractive element (122) comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.
    Type: Application
    Filed: September 12, 2009
    Publication date: July 14, 2011
    Applicant: NXP B.V.
    Inventors: Erwin Hijzen, Magali Lambert
  • SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110027128
    Abstract: A sensor chip (100) for detecting particles, the sensor chip (100) comprising a substrate (102), an electric connection structure (104) arranged in a surface portion of the substrate (102) and adapted for an electric connection to an electric connection element (106), a sensor active region (108) arranged in another surface portion of the substrate (102) and being sensitive to the presence of the particles to be detected, and a continuous dielectric layer (110) covering the substrate (102) including covering the electric connection structure (104) and the sensor active region (108).
    Type: Application
    Filed: March 19, 2009
    Publication date: February 3, 2011
    Applicant: NXP B.V.
    Inventors: Evelyne Gridelet, Franciscus Widdershoven, Pablo Garcia Tello, Magali Lambert