Patents by Inventor Maged M. Ghoneima

Maged M. Ghoneima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7326972
    Abstract: A device includes an interconnect structure having a number of circuit paths to transfer signals. The circuit paths transfer the signals at different speed to reduce the coupling capacitance effect between adjacent circuit paths.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: February 5, 2008
    Assignee: Intel Corporation
    Inventors: Maged M. Ghoneima, Muhammad M. Khellah, James W. Tschanz, Yibin Ye, Vivek K. De
  • Patent number: 7190286
    Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: March 13, 2007
    Assignee: Intel Corporation
    Inventors: Maged M. Ghoneima, Peter Caputa, Muhammad M. Khellah, Ram Krishnamurthy, James W. Tschanz, Yiben Ye, Vivek K. De, Yehea I. Ismail
  • Patent number: 6992603
    Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 31, 2006
    Assignee: Intel Corporation
    Inventors: Maged M. Ghoneima, Peter Caputa, Muhammad M. Khellah, Ram Krishnamurthy, James W. Tschanz, Yiben Ye, Vivek K. De, Yehea I Ismail