Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.

Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.

Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).

Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.

Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.

Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).