Abstract: A communication device including one or more processors configured to perform a radio measurement to obtain a reception metric; identify a potential power reduction from a plurality of power reductions; scale the reception metric to compensate for the potential power reduction to obtain a reduced reception metric; and select a transmit power or a transmit repetition count for a radio frequency transceiver based on the reduced reception metric.

Abstract: A communication device including one or more processors configured to perform a radio measurement to obtain a reception metric; identify a potential power reduction from a plurality of power reductions; scale the reception metric to compensate for the potential power reduction to obtain a reduced reception metric; and select a transmit power or a transmit repetition count for a radio frequency transceiver based on the reduced reception metric.

Abstract: A communication device includes a measurement engine configured to perform a radio measurement to obtain a reception metric, a power reduction database configured to identify a potential power reduction from a plurality of power reductions, a metric scaler configured to scale the reception metric to compensate for the potential power reduction to obtain a reduced reception metric, and a transmit controller configured to select a transmit power or a transmit repetition count for a radio frequency transceiver based on the reduced reception metric.

Abstract: A communication device includes a measurement engine configured to perform a radio measurement to obtain a reception metric, a power reduction database configured to identify a potential power reduction from a plurality of power reductions, a metric scaler configured to scale the reception metric to compensate for the potential power reduction to obtain a reduced reception metric, and a transmit controller configured to select a transmit power or a transmit repetition count for a radio frequency transceiver based on the reduced reception metric.

Abstract: A package-on-package stack may include an upper package, an optical interface, and a lower package. The upper package may send an optical signal from a first component in the upper package. The optical interface may receive the optical signal from the upper package, and may transmit the optical signal. The lower package may receive the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard.

Abstract: A semiconductor assembly that may enhance dissipation of heat. The assembly includes a first die of a first material and defining a first passage. A second material, such as silicon carbide, diamond, or carbon nanotube, having a higher heat conductivity than the first material is disposed in the center of the first passage. An electronic component, which may be, for example, another die or a printed wiring board, is adjacent to the first die, is predominantly of a third material, and defines a first opening. A fourth material having a higher heat conductivity than the third material is disposed in the center of the first opening. The first opening is in alignment with the first passage, and may provide for heat transfer with a chimney effect between the materials of relatively high heat conductivity. A mold including a high heat conductivity material may also be provided.

Abstract: A package-on-package stack may include an upper package, an optical interface, and a lower package. The upper package may send an optical signal from a first component in the upper package. The optical interface may receive the optical signal from the upper package, and may transmit the optical signal. The lower package may receive the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard.

Abstract: A package-on-package stack may include an upper package, an optical interface, and a lower package. The upper package may send an optical signal from a first component in the upper package. The optical interface may receive the optical signal from the upper package, and may transmit the optical signal. The lower package may receive the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard.

Abstract: A coupling element, for example a coupling sleeve (1), having coupling teeth (2) which, over a part (2a) of their length, have a gradually diminishing cross-sectional profile, a so-called back rake. Over the part, the coupling teeth have a portion (7b) nearest the tooth root having a first pressure angle, which portion connects to a portion (7b) extending to the tooth tip and having a greater pressure angle than the former portion.

Abstract: A package-on-package stack may include an upper package, an optical interface, and a lower package. The upper package may send an optical signal from a first component in the upper package. The optical interface may receive the optical signal from the upper package, and may transmit the optical signal. The lower package may receive the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard.

Abstract: A coupling element, for example a coupling sleeve (1), having coupling teeth (2) which, over a part (2a) of their length, have a gradually diminishing cross-sectional profile, a so-called back rake. Over the part, the coupling teeth have a portion (7b) nearest the tooth root having a first pressure angle, which portion connects to a portion (7b) extending to the tooth tip and having a greater pressure angle than the former portion.