Abstract: In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.

Abstract: A template chuck includes multiple zones to provide 1) an imprint bend optimized to provide high curvature and provide contact at middle radius of substrate and/or, 2) separation bend zone with an increased free span zone and high crack angle.

Abstract: The present invention provides a method for separating a mold from solidified imprinting material that includes creating deformation in the template in which the mold is included. The deformation is sufficient to create a returning force that is greater than an adhesion forced between the solidified imprinting material and the mold. For example, the deformation may result from a pressure differential created between the mold and a side of the template disposed opposite to the mold. In this manner, the distortion may be undulations in the template of sufficient magnitude to contact a substrate upon which the solidified imprinting material is disposed.

Abstract: Systems and methods for imprinting a patterned layer on a substrate are described. Features of patterned layer may be concentrically imprinted in relation to a shaft positioned on a substrate chuck. The substrate may be biased using a radius difference between a diameter of the shaft and an inner diameter of the substrate in relation to a point on an inner edge of the substrate.

Abstract: Systems, methods, and processes for separating a template from a substrate retained on an air cavity chuck during an imprint lithography process. Generally, vacuum level provided by air cavity chuck may be controlled during conforming of polymerizable material between the template and the substrate and during separation of the template and the substrate.

Abstract: Energy sources and methods for curing in an imprint lithography system are described. The energy sources may include one or more energy elements positioned outside of the viewing range of an imaging unit monitoring elements of the imprint lithography system. Each energy source is configured to provide energy along a path to solidify polymerizable material on a substrate.

Abstract: System, method and process for imprinting a substrate using controlled deformation of a substrate and/or a template. The substrate and/or template may be positioned in single wave formation or double wave formation during an imprint lithography process.

Abstract: The present invention is directed towards a method of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.

Abstract: The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the method includes creating a point contact on the first surface to generate a change in shape of the second surface to obtain a desired shape of the second surface. The desired shape may be smooth, if not substantially planar or any other shape desired within the operational parameters of the chuck and the substrate. For example, the method may compensate for non-planarity due to particulate matter on the first surface and substrate topography. These and other embodiments are discussed more fully below.

Abstract: The present method and system features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the support system includes a chuck having a plurality of piezo pins and reference pins, with the piezo pins being coupled to piezo actuators to undergo relative movement with respect to said reference pins. These and other embodiments are discussed more fully below.

Abstract: The present invention is directed towards a method of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.

Abstract: A method for spreading a conformable material between a substrate and a template having a mold. The method comprises positioning the mold to be in superimposition with the substrate defining a volume therebetween. A first sub-portion of the volume is charged with the conformable material through capillary action between the conformable material and one of the mold and the substrate. A second sub-portion of the volume is filled with the conformable material by creating a deformation in the mold.

Abstract: The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the method includes creating a point contact on the first surface to generate a change in shape of the second surface to obtain a desired shape of the second surface. The desired shape may be smooth, if not substantially planar or any other shape desired within the operational parameters of the chuck and the substrate. For example, the method may compensate for non-planarity due to particulate matter on the first surface and substrate topography. These and other embodiments are discussed more fully below.

Abstract: The present method and system features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the support system includes a chuck having a plurality of piezo pins and reference pins, with the piezo pins being coupled to piezo actuators to undergo relative movement with respect to said reference pins. These and other embodiments are discussed more fully below.