Patents by Inventor Mahadevan Krishnamurthy Narayana Swamy

Mahadevan Krishnamurthy Narayana Swamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitive sensing button on chip
    Patent number: 10969249
    Abstract: A method, apparatus, and system use logic circuitry arranged within an integrated circuit to: convert a self capacitance of a first sensor element arranged within the integrated circuit to a digital value, and apply a signal to an output pin of the integrated circuit based on the self capacitance.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: April 6, 2021
    Assignee: Cypress Semiconductor Coproration
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David G. Wright, Steve Kolokowsky
  • Capacitive Sensing Button On Chip
    Publication number: 20170255297
    Abstract: A method and apparatus include a plurality of sensor elements arranged within an integrated circuit package and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements. The controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements. The receive signal represents a mutual capacitance of the first sensor element and the second sensor element.
    Type: Application
    Filed: February 15, 2017
    Publication date: September 7, 2017
    Applicant: Cypress Semiconductor Corporation
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David G. Wright, Steve Kolokowsky
  • Capacitive sensing button on chip
    Patent number: 9588626
    Abstract: A method and apparatus include a plurality of sensor elements arranged within an integrated circuit package and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements. The controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements. The receive signal represents a mutual capacitance of the first sensor element and the second sensor element.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: March 7, 2017
    Assignee: CYPRESS SEMICONDUCTOR CORPORATION
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David G. Wright, Steve Kolokowsky
  • Capacitive Sensing Button On Chip
    Publication number: 20150293625
    Abstract: A method and apparatus include a plurality of sensor elements arranged within an integrated circuit package and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements. The controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements. The receive signal represents a mutual capacitance of the first sensor element and the second sensor element.
    Type: Application
    Filed: February 26, 2015
    Publication date: October 15, 2015
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David G. Wright, Steve Kolokowsky
  • Capacitive sensing button on chip
    Patent number: 8970230
    Abstract: An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: March 3, 2015
    Assignee: Cypress Semiconductor Corporation
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David Wright, Steven Kolokowsky
  • Capacitive Sensing Button On Chip
    Publication number: 20120217982
    Abstract: An embodiment of an integrated circuit device may comprise an integrated circuit package, a sensor element attached within the integrated circuit package, a capacitance sensor coupled with the sensor element and situated within the integrated circuit package, wherein the capacitance sensor is configured to measure a capacitance of the sensor element, and an output pin positioned at the exterior of the integrated circuit package, wherein the output pin is configured to carry a signal based on the measured capacitance of the sensor element.
    Type: Application
    Filed: December 29, 2011
    Publication date: August 30, 2012
    Applicant: CYPRESS SEMICONDUCTOR CORPORATION
    Inventors: Rajagopal Narayanasamy, Mahadevan Krishnamurthy Narayana Swamy, David Wright, Steven Kolokowsky