Patents by Inventor Mahadi-Ul Hassan

Mahadi-Ul Hassan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRE-PACKAGED CHIP, METHOD OF MANUFACTURING A PRE-PACKAGED CHIP, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
    Publication number: 20220230982
    Abstract: A pre-packaged chip includes a chip having at least one electrical top contact at a top side of the chip and at least one electrical bottom contact at a bottom side, a first laminate layer on the top side, a second laminate layer on the bottom side, the first laminate layer and the second laminate layer being laminated together to sandwich the chip therebetween, a first metal layer on the first laminate layer and electrically contacted to the at least one electrical top contact via at least one top contact hole through the first laminate layer, and a second metal layer on the second laminate layer and electrically contacted to the at least one electrical bottom contact via at least one bottom contact hole through the second laminate layer. The pre-packaged chip is free from any contact hole extending from the first metal layer to the second metal layer.
    Type: Application
    Filed: January 19, 2022
    Publication date: July 21, 2022
    Inventors: Petteri Palm, Eslam Abdelhamid, Thomas Gebhard, Mahadi-Ul Hassan, Juan Sanchez, Martin Henning Vielemeyer