Abstract: A package comprising a substrate comprising at least one dielectric layer and a plurality of interconnects; a first integrated device coupled to the substrate through a first plurality of solder interconnects, wherein the first plurality of solder interconnects includes a first plurality of inner solder interconnects and a first plurality of perimeter solder interconnects; and a second integrated device coupled to the substrate through a second plurality of solder interconnects. The first integrated device is configured to be electrically coupled to the second integrated device through an electrical path. The electrical path comprises an inner solder interconnect from the first plurality of inner solder interconnects, at least one interconnect from the plurality of interconnects, and a solder interconnect from the second plurality of solder interconnects.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second TO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: A method for providing low latency frequency switching includes operating a first processing component on a first die and operating a second processing component on a second die with the same first clock signal having a first frequency. A request to switch the first frequency to a second, new frequency is received and a second clock signal having the second, new frequency is produced. Data flow between the first die and second die may be stopped. And then the second clock signal is transmitted to a dual phased locked loop architecture on a die interface. A PCLK signal is created from the combined first and second clock signals and an NCLK signal is created from the second clock signal. Next, the PCLK signal is divided and aligned with the NCLK signal. Once the PCLK signal is aligned with the NCLK signal, data flow is resumed between the two dies.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second TO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second IO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: Methods and apparatuses for improve clocking scheme to reduce power consumption are presented. The apparatus includes a host configured to communicate with a memory via a link. The host is further configured to receive a first clock from the memory; to receive, based on the first clock, data from the memory, in a first mode of a read operation; to generate a second clock, the second clock being generated independent of the first clock; and to receive, based on the second clock, data from the memory, in a second mode of the read operation.

Abstract: Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second IO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.

Abstract: Signal timing drift in a synchronous dynamic random access memory (SDRAM) system may be compensated for by performing write signal timing training using a multi-purpose command (MPC) first-in-first-out (FIFO) write and MPC FIFO read at periodic intervals interspersed with mission-mode SDRAM traffic. The test result samples obtained from the write signal timing training may be analyzed independently of mission-mode SDRAM traffic. The mission-mode timing of the SDRAM data bit signals relative to the SDRAM write clock signal may be adjusted based on the analysis.

Abstract: Signal timing drift in a synchronous dynamic random access memory (SDRAM) system may be compensated for by performing write signal timing training using a multi-purpose command (MPC) first-in-first-out (FIFO) write and MPC FIFO read at periodic intervals interspersed with mission-mode SDRAM traffic. The test result samples obtained from the write signal timing training may be analyzed independently of mission-mode SDRAM traffic. The mission-mode timing of the SDRAM data bit signals relative to the SDRAM write clock signal may be adjusted based on the analysis.

Abstract: In some embodiments, a differential amplifier with duty cycle correction is provided.

Abstract: In some embodiments, a differential amplifier with duty cycle correction is provided.

Abstract: In some embodiments, a differential amplifier with duty cycle correction is provided.

Abstract: Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Abstract: Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Abstract: In some embodiments, a differential amplifier with duty cycle correction is provided.

Abstract: Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Abstract: Described herein are an apparatus, system, and method for compensating voltage swing and duty cycle of a signal on an input-output (I/O) pad of a processor by adjusting the voltage swing and duty cycle of the signal. The apparatus comprises a driver to transmit a signal on an I/O pad, the signal on the I/O pad having a voltage swing and a duty cycle; and an adjustment unit, coupled to the driver, to receive the signal from the I/O pad transmitted by the driver and to generate voltage swing and duty cycle control signals for adjusting the voltage swing and duty cycle of the signal on the I/O pad respectively. Described herein is also an analog-to-digital (A2D) converter for measuring and/or calibrating various signal attributes including current, voltage, and time.

Abstract: A transmitter architecture includes an equalizer and a D/A converter, for high-speed transmission of data across a channel. The equalizer includes a two-tap MAC as part of an N-stage, two-way interleaved FIR filter. The two-tap MAC provides substantial power and area savings over conventional MAC-based FIR filter designs, and may be implemented in short or long communications channels. The D/A converter is decoupled from the equalizer. Its N-bit, binary-weighted driver includes matched unit current generation cells, all of which are fully utilized during each digital-to-analog conversion. The D/A converter remains unchanged, even when the characteristics of the equalizer are changed.

Abstract: An apparatus for controllably distorting the duty cycle of a clock signal is disclosed. Methods and systems using embodiments of the invention are also described.

Abstract: A transmitter architecture includes an equalizer and a D/A converter, for high-speed transmission of data across a channel. The equalizer includes a two-tap MAC as part of an N-stage, two-way interleaved FIR filter. The two-tap MAC provides substantial power and area savings over conventional MAC-based FIR filter designs, and may be implemented in short or long communications channels. The D/A converter is decoupled from the equalizer. Its N-bit, binary-weighted driver includes matched unit current generation cells, all of which are fully utilized during each digital-to-analog conversion. The D/A converter remains unchanged, even when the characteristics of the equalizer are changed.