Abstract: A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding.

Abstract: A thermal fuse is formed by a conductive path formed in a ceramic body, the path being of a fusible alloy. A ceramic substrate and a ceramic cover, both in green form, are fused together with defined channels. The channels can be defined by a material which is burnt out, preferably when the ceramic members are fused together. The channels can be defined in other ways. The channels are filled with a fusible alloy leaving an air layer, end contacts being provided. Several channels can be formed in one assembly. The assembly can then be cut into separate fuses, each with one channel.

Abstract: A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is formed on at least one surface and the circuit pattern extends to and over a surface of each formation. A circuit board can be planar or non-planar and be of any desired shape, not necessarily rectangular.

Abstract: A carrier for leadless electrical and electronic components has a plurality of recesses, for reception of components. Electrically conductive paths formed on surfaces in the recesses make contact with contacts on the components. The conductive paths extend onto a bottom surface of the carrier and over protrusions or feet on the bottom surface. The protrusions make contact with contact pads on a circuit pattern on a circuit board. The carrier holds components which otherwise could be as readily mounted to the surface of a circuit board as can the carrier. A high number of components per unit surface area of a circuit board can be mounted via the carrier. The carrier can be positioned by an automated apparatus.