Patents by Inventor Maher A. Serag

Maher A. Serag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7097422
    Abstract: A hoop stress relief mechanism is disclosed for use on a rotary body to relieve stress caused by both thermal and centrifugal forces. The mechanism may consist of a J-shaped slot cut from the outer rim of the rotary body a distance inwardly toward the axis of rotation, the slot having a curve in its inward end that curves back towards the outer rim. The J-shaped slot may extend through the rotary body to join its two faces. The J-shaped slot may be fabricated by an electric discharge wire machine. The electric discharge wire machine may make multiple passes in order to smooth the bottom surface of the curved slot portion.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: August 29, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Derek A. Rice, David R. Waldman, Redge How, Maher A. Serag, Paul D. Rippey, Charles P. Silcox, Henry L. Chester, Ramasami (Rajan) Thiyagarajan, Hsin-Yi Liu, Paul E. Hruska, Richard E. Jackson, David A. Innes, Gordon B. Bailey
  • Publication number: 20060099078
    Abstract: A hoop stress relief mechanism is disclosed for use on a rotary body to relieve stress caused by both thermal and centrifugal forces. The mechanism may consist of a J-shaped slot cut from the outer rim of the rotary body a distance inwardly toward the axis of rotation, the slot having a curve in its inward end that curves back towards the outer rim. The J-shaped slot may extend through the rotary body to join its two faces. The J-shaped slot may be fabricated by an electric discharge wire machine. The electric discharge wire machine may make multiple passes in order to smooth the bottom surface of the curved slot portion.
    Type: Application
    Filed: February 3, 2004
    Publication date: May 11, 2006
    Applicant: Honeywell International Inc.,
    Inventors: Derek Rice, David Waldman, Redge How, Maher Serag, Paul Rippey, Charles Silcox, Chester Henry, Ramasami (Rajan) Thiyagarajan, Hsin-Yi Liu, Paul Hruska, Richard Jackson, David Innes, Gordon Bailey