Abstract: A gang drilling machine for drilling a circuit card includes a pair of n and p master drills that are configured to be aligned in registry with respective n and p test vias of the card; pluralities of n and p minion drills that are configured to be aligned in registry with pluralities of n and p live vias of the card; and a controller that is electrically connected to control the n and p master drills and minion drills, and to send and receive electrical signals to and from the card. The controller is configured to: send a query signal to the card; monitor a response signal from the card; determine drilling depth of at least one of the master drills, in response to comparing the response signal to the query signal; and adjust operation of the machine, in response to the determined drilling depth.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A method includes manipulating at least one electric signal received from one or more electronic components to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes, said one of n distinct slopes to be transmitted utilizing a particular reference voltage of n predetermined reference voltages. The method further includes transmitting data as the particular reference voltage of the n predetermined reference voltages to at least one electronic component utilizing slope manipulation.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A method includes manipulating at least one electric signal received from one or more electronic components to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes, said one of n distinct slopes to be transmitted utilizing a particular reference voltage of n predetermined reference voltages. The method further includes transmitting data as the particular reference voltage of the n predetermined reference voltages to at least one electronic component utilizing slope manipulation.

Abstract: An information handling system device includes a plurality of electronic components; an electric circuit including at least one trace for connecting two or more of the plurality of electronic components and transmitting data between the plurality of electronic components via at least one electric signal; and a substrate including an insulating material for serving as a base for the electric circuit, wherein each of the at least one electric signal transmitted between the plurality of electronic components is transmitted utilizing slope manipulation by manipulating each of the at least one electric signal to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes transmitted utilizing a particular reference voltage of n predetermined reference voltages.

Abstract: For testing whether an optical fiber is properly connected to a device, a beam of light is output to the optical fiber. An intensity is detected of light reflected by the device back through the optical fiber in response to the beam of light. In response to the detected intensity, a determination is made of whether the optical fiber is properly connected to the device.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: An information handling system device includes a plurality of electronic components; an electric circuit including at least one trace for connecting two or more of the plurality of electronic components and transmitting data between the plurality of electronic components via at least one electric signal; and a substrate including an insulating material for serving as a base for the electric circuit and the plurality of electronic components, wherein the at least one electric signal transmitted between the plurality of electronic components is transmitted utilizing slope manipulation to provide a slope directly proportional to a data value.

Abstract: An information handling system device includes a plurality of electronic components; an electric circuit including at least one trace for connecting two or more of the plurality of electronic components and transmitting data between the plurality of electronic components via at least one electric signal; and a substrate including an insulating material for serving as a base for the electric circuit, wherein each of the at least one electric signal transmitted between the plurality of electronic components is transmitted utilizing slope manipulation by manipulating each of the at least one electric signal to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes transmitted utilizing a particular reference voltage of n predetermined reference voltages.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.