Abstract: A control system and method of controlling access to storage bins in a vehicle. The system includes a lock configured to be selectively movable between a locked position to prevent access to an interior of the storage bins and an unlocked position to allow access to the interior of the storage bins. A switch is positioned in a cabin of the vehicle. A control circuit is configured to determine an operational status of the vehicle and selectively position the locks. The control circuit can also receive an override signal from the switch and unlock the locks in certain situations.

Abstract: A control system and method of controlling access to storage bins in a vehicle. The system includes a lock configured to be selectively movable between a locked position to prevent access to an interior of the storage bins and an unlocked position to allow access to the interior of the storage bins. A switch is positioned in a cabin of the vehicle. A control circuit is configured to determine an operational status of the vehicle and selectively position the locks. The control circuit can also receive an override signal from the switch and unlock the locks in certain situations.

Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.

Abstract: Surface mounting of components includes providing a substrate that has a first surface and a second surface. A portion of the first surface is coupled to a conductive layer that is patterned. A compliant layer is introduced to the first surface of the substrate and to the conductive layer. At least one aperture is formed in the compliant layer which extends to the surface of the conductive layer. Conductive material is introduced into the aperture(s). Solder couples the surface mount component to the compliant layer.

Abstract: A filter insert for a terminal connector includes a rigid substrate and low-cost interference fit connections between the filter insert circuitry and the connector terminals. In a first embodiment, the insert includes a flexible circuit bonded to the rigid substrate, and the substrate is provided with over-sized openings that the terminals pass through without interference. A second embodiment is like the first, except that the filter circuit traces are formed directly on the rigid substrate, and the substrate material backing the terminal connection sites is removed to form the over-sized openings.