Patents by Inventor Mahesh Iyer

Mahesh Iyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12273107
    Abstract: Embodiments of the present disclosure are related to dynamically adjusting a timing and/or power model for a programmable logic device. In particular, the present disclosure is directed to adjusting a timing and/or power model of the programmable logic device that operates at a voltage level that is not other than a predefined voltage defined by a voltage library. A system of the present disclosure may interpolate between voltage levels defined by the voltage libraries to generate a new voltage library for the programmable logic device. A timing and/or power model may be generated for the programmable logic device based on the new voltage library and the programmable logic device may be analyzed using the timing and/or power model at the interpolated voltage. The timing and/or power model may be used to generate a bitstream that is used to program the integrated circuit.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: April 8, 2025
    Assignee: Altera Corporation
    Inventors: Atul Maheshwari, Mahesh Iyer, Mahesh K. Kumashikar, Ian Kuon, Yuet Li, Ankireddy Nalamalpu, Dheeraj Subbareddy
  • Patent number: 12261778
    Abstract: Aspects of the disclosure relate to real-time management of data container generation, authorization, and throttling. In some embodiments, a computing platform may receive a first data container and retrieve a first data container management file associated with the first data container. The computing platform may then perform a first preliminary analysis of the first data container, including analyzing the first data container and the first data container management file to determine whether a first predetermined communication path requires additional throttling analysis. If additional throttling analysis is required, the computing platform may send analysis messages to a data container throttling module to extract a first communication entity listed in the first predetermined communication path.
    Type: Grant
    Filed: March 23, 2023
    Date of Patent: March 25, 2025
    Assignee: Bank of America Corporation
    Inventors: Manu Kurian, Paul Roscoe, Padmanabhan Iyer, Mahesh Bhashetty
  • Patent number: 12253870
    Abstract: A circuit system includes a first voltage regulator circuit that generates a first supply voltage for an integrated circuit die based on a first control signal. The first voltage regulator circuit generates a first feedback signal based on the first supply voltage. The circuit system also includes a second voltage regulator circuit that generates a second supply voltage for an integrated circuit die based on a second control signal. The second voltage regulator circuit generates a second feedback signal based on the second supply voltage. The circuit system also includes a third voltage regulator circuit that generates the first control signal based on the first feedback signal and the second control signal based on the second feedback signal. The circuit system may include fully integrated, on-board, and on-package voltage regulator circuits.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: March 18, 2025
    Assignee: Altera Corporation
    Inventors: Archanna Srinivasan, Ravi Gutala, Scott Weber, Aravind Dasu, Mahesh Iyer, Eriko Nurvitadhi
  • Patent number: 12255648
    Abstract: A circuit system includes a first integrated circuit die having a first group of circuits configured to perform a first set of operations. The circuit system also includes a second integrated circuit die having a second group of circuits configured to start performing a second set of operations with a delay after the first group of circuits starts performing the first set of operations to reduce power supply voltage droop. The operations performed by the first and second groups of circuits can be interleaved with a fixed or a variable delay. Logic circuits can be partitioned into the first and the second groups of circuits based on predicted switching activity of the logic circuits. Decoupling capacitors in integrated circuit dies can be coupled together to reduce droop in a supply voltage during a high current event.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: March 18, 2025
    Assignee: Altera Corporation
    Inventors: Archanna Srinivasan, Ravi Gutala, Scott Weber, Aravind Dasu, Mahesh Iyer, Eriko Nurvitadhi
  • Patent number: 12222928
    Abstract: Arrangements for controlling data retrieval are provided. In some aspects, a data request may be received by a computing platform. A pre-fetch engine may be executed to analyze the data request and generate, using a machine learning model, a pre-fetch template identifying data sets responsive to the request. The pre-fetch template may be transmitted to one or more data repositories and at least one data repository may transmit response data sets to the computing platform. An issue in the mesh network through which the data sets are transmitted may be detected and the data sets may be stored at a data silo associated with a node of the mesh network. An alternate transmission path may be generated and the data may be transmitted from the data silo of the node to another node in the mesh network based on the alternate transmission path.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: February 11, 2025
    Assignee: Bank of America Corporation
    Inventors: Manu Kurian, Padmanabhan Iyer, Paul Roscoe, Mahesh Bhashetty
  • Patent number: 12216150
    Abstract: A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: February 4, 2025
    Assignee: Altera Corporation
    Inventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan
  • Publication number: 20240184966
    Abstract: Embodiments herein are directed to systems and techniques for supporting heterogeneous logic architecture in programmable devices, such as field-programmable gate arrays (FPGAs). heterogeneous logic architectures may include additional logic elements (e.g., AND-inverter cones (AICs)) in addition to lookup tables (LUTs). Accordingly, it may be desirable to provide a compiler flow that supports heterogeneous FPGA architecture, taking advantage of a combination of LUTs and other logic elements (e.g., AICs) to improve resource utilization (e.g., die area, wire length) and improve maximum clock frequency and compile time.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 6, 2024
    Inventors: Babette Van Antwerpen, Anthea Au, Selvin Quadro, Mahesh Iyer, Grace Zgheib
  • Patent number: 12003238
    Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: June 4, 2024
    Assignee: Intel Corporation
    Inventors: Scott Jeremy Weber, Aravind Raghavendra Dasu, Mahesh A. Iyer, Patrick Koeberl
  • Publication number: 20240020449
    Abstract: Systems or methods of the present disclosure may provide a library including multiple macros that may be pre-compiled prior to implementation of the design. For example, a design may be mapped to one or more macros in the library, and the one or more macros may be placed into and routed between a portion of a region, one region, one or more regions of the integrated circuit device to implement the design. Since the macros may be pre-compiled, compilation time experienced by the designer may correspond to the placement and routing of the one or more macros, which may be less than compilation time for fine-grained operations. The pre-compiled logic within the macros may be set using a lookup table mask to set and/or adjust a functionality of the macro. Additionally or alternatively, the place and route operation may be performed at finer granularities to reduce bottle necks.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Byron Sinclair, Deshanand P. Singh, Gregg William Baeckler, Mahesh A. Iyer, Michael Kinsner, Chengping Liang, Victor Tzi-on Zhang
  • Publication number: 20230333826
    Abstract: Systems or methods of the present disclosure may provide a library including multiple regional bits streams that may be pre-generated by a manufacturer and/or custom generated by a designer that may be used to implement a design onto an integrated circuit device. The design may be decomposed into one or more regional bitstreams and stitched to form a larger combined bitstream to be implemented as coarse-grained operations on the integrated circuit device, thereby decreasing compilation time experienced by the designer. The combined bitstreams may be loaded into all or a portion of the integrated circuit device to realize the design. Additionally or alternatively, the integrated circuit device may include a hardened networks-on-chip to improve data routing within the combined bitstream.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Inventors: Michael Kinsner, Byron Sinclair, Deshanand P. Singh, Scott Jeremy Weber, Mahesh A. Iyer, Chengping Liang, Victor Tzi-on Zhang, Gabriel Quan
  • Patent number: 11789641
    Abstract: A three dimensional circuit system includes a first integrated circuit die having a core logic region that has first memory circuits and logic circuits. The three dimensional circuit system includes a second integrated circuit die that has second memory circuits. The first and second integrated circuit dies are coupled together in a vertically stacked configuration. The three dimensional circuit system includes third memory circuits coupled to the first integrated circuit die. The third memory circuits reside in a plane of the first integrated circuit die. The logic circuits are coupled to access the first, second, and third memory circuits and data can move between the first, second, and third memories. The third memory circuits have a larger memory capacity and a smaller memory access bandwidth than the second memory circuits. The second memory circuits have a larger memory capacity and a smaller memory access bandwidth than the first memory circuits.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Scott Weber, Jawad Khan, Ilya Ganusov, Martin Langhammer, Matthew Adiletta, Terence Magee, Albert Fazio, Richard Coulson, Ravi Gutala, Aravind Dasu, Mahesh Iyer
  • Publication number: 20230237231
    Abstract: Systems or methods of the present disclosure may provide an electronic device that includes memory storing instructions; and a processor, that when executing the instructions, is to receive a design for a programmable fabric of an integrated circuit device. The instructions are also to cause the processor to cause compilation of the design into a configuration during a compilation window. The instructions further are to cause the processor to determine at least some routing for the configuration outside of the compilation window.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Inventors: Byron Sinclair, Michael Kinsner, Gabriel Quan, Victor Tzi-on Zhang, Mahesh A. Iyer, Chengping Liang, Deshanand P. Singh
  • Publication number: 20230237230
    Abstract: Systems or methods of the present disclosure may provide a library including multiple personas that may be pre-generated by a manufacturer and/or custom generated by a designer that may be used to implement a design onto an integrated circuit device. The design may be decomposed into one or more personas to be implemented as coarse-grained operations on the integrated circuit device, thereby decreasing compilation time experienced by the designer. The personas may be loaded into one or more regions of the integrated circuit device to realize the design. That is, the design may be realized by one persona may be implemented across multiple regions, one region may be configured by multiple personas, one persona configuring one region, or any combination thereof. Additionally or alternatively, the integrated circuit device may include networks-on-chip to improve data routing between the regions.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Inventors: Michael Kinsner, Byron Sinclair, Deshanand P. Singh, Scott Jeremy Weber, Anandh Venkateswaran, Mahesh A. Iyer
  • Publication number: 20230222275
    Abstract: A method is provided for processing code for a circuit design for an integrated circuit using a computer system. The method includes receiving at least a portion of the code for the circuit design for the integrated circuit, wherein the portion of the code comprises an error or has incomplete constraints, making an assumption about the error and the missing constraints using a computer aid design tool, and generating a revised circuit design for the integrated circuit with the error corrected and any missing constraints added based on the assumption and based on the code using the computer aided design tool and a library of components for circuit designs.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 13, 2023
    Applicant: Intel Corporation
    Inventors: Gregg Baeckler, Mahesh A. Iyer, Martin Langhammer
  • Publication number: 20230129176
    Abstract: A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 27, 2023
    Applicant: Intel Corporation
    Inventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan
  • Patent number: 11609262
    Abstract: An integrated circuit die includes a core fabric configurable to include an aging measurement circuit and a device manager coupled to the core fabric to operate the aging measurement circuit for a select period of time. The aging measurement circuit includes a counter to count transitions of a signal propagating through the aging measurement circuit during the select period of time when the aging measurement circuit is operating. The transitions of the signal counted by the counter during the select period of time are a measure of an aging characteristic of the integrated circuit die.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan
  • Patent number: 11574101
    Abstract: Systems and methods are provided for using an integrated circuit design tool to analyze timing requirements of a circuit design for an integrated circuit. A slack is calculated for a timing path in the circuit design that fails to satisfy a timing constraint. The slack is decomposed into multiple categories of delays in the timing path. The categories of delays for the slack may include intrinsic margin, clock skew, logic delay, and fabric interconnect delay. The logic delay may include local interconnect delay and logic circuit delay. The fabric interconnect delay may include delays in interconnect elements that are used to make connections between larger blocks of the logic circuits. Different optimization strategies are provided to solve the timing constraint failure for each of the different categories of slack breakdown. Slack profiles of the entire design in each of the four categories of slack are also provided.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Scott Whitty, Mahesh A. Iyer
  • Publication number: 20230027064
    Abstract: Systems and methods of the present disclosure provide techniques for reducing power consumption of a large combinational circuit using register insertion. In particular, a large circuit may be analyzed to determine the amount of signal switching at various logical points (e.g., stages in the computation) of the circuit. A clock sequence with many pulses in the period of a clock that runs the large combinatorial circuit may be generated. To balance the amount of signal switching at various logical points in the circuit, registers may be inserted at certain points in the large circuit with the clock pulses of the clock sequence assigned to the registers that may not have a constant frequency or may be phase shifted versions of the main clock.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Inventors: Martin Langhammer, Gregg William Baeckler, Sergey Vladimirovich Gribok, Mahesh A. Iyer
  • Publication number: 20230024515
    Abstract: A programmable logic device may include a first layer formed using backside metallization on a back plane of the programmable logic device and a second fabric routing circuitry to route second data within the programmable fabric. The first layer may include first fabric routing circuitry to route first data within a programmable fabric of the programmable logic device, and clock routing circuitry to route clock signals within the programmable fabric.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Inventors: Atul Maheshwari, Mahesh K. Kumashikar, Ankireddy Nalamalpu, MD Altaf Hossain, Mahesh A. Iyer
  • Publication number: 20230018414
    Abstract: The present disclosure describes techniques for incorporating pipelined DSP blocks or other types of embedded functions into a logic circuit with a slower clock rate without any clock crossing complexities, and at the same time managing the power consumption of the more complex design that results from it. The techniques include generating a faster clock or several faster clocks that may have a faster clock rate than the clock used by the logic circuit and that may be used as clock input to the embedded pipelined DSP blocks. In addition, the present disclosure describes techniques for generating, improving, and using the faster clock to sample the output of a logic circuit using pulses of generated faster clock, which may allow to increase the clock frequency of the circuit to an optimal level, while maintaining functional correctness.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Inventors: Martin Langhammer, Gregg William Baeckler, Sergey Vladimirovich Gribok, Mahesh A. Iyer