Patents by Inventor Maheshchandra Mistry

Maheshchandra Mistry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diebond strip
    Publication number: 20060255104
    Abstract: A titanium alloy strip which has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the titanium alloy strip allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Application
    Filed: July 18, 2006
    Publication date: November 16, 2006
    Inventors: Maheshchandra Mistry, Christopher Main
  • Diebond strip
    Patent number: 7100815
    Abstract: A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: September 5, 2006
    Assignee: Avago Technologies Fiber IP (Singapore) Ptd. Ltd.
    Inventors: Maheshchandra Mistry, Christopher Main
  • Diebond strip
    Publication number: 20040195295
    Abstract: A titanium alloy strip has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 7, 2004
    Applicant: AGILENT TECHNOLOGIES, INC.
    Inventors: Maheshchandra Mistry, Christopher Main
  • Diebond strip
    Patent number: 6752308
    Abstract: A titanium alloy strip which has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the titanium alloy strip allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: June 22, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Maheshchandra Mistry, Christopher Main
  • Diebond strip
    Publication number: 20030010810
    Abstract: The present invention discloses a Titanium alloy strip (50) which has a reduced cross section in the central region (70) of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the present invention allows for the possibility of removing the laser device from the substrate without destroying the laser device.
    Type: Application
    Filed: July 12, 2002
    Publication date: January 16, 2003
    Applicant: Agilent Technologies, Inc.
    Inventors: Maheshchandra Mistry, Christopher Main