Abstract: Module with ball grid array having increased die area. In some embodiments, a packaged module can include a packaging substrate having side edges, and a grid array arranged on an underside of the packaging substrate. The grid array can include a plurality of mounting features arranged in at least two rows, with each row being along the respective side edge of the packaging substrate, such that at least one side edge of the packaging substrate is without a row of mounting features. The packaged module can further include a component mounted to the underside of the packaging substrate and within a mountable area defined by the at least two rows of mounting features and the at least one side edge of the packaging substrate without the row of mounting features.