Abstract: A light emitting device made in accordance with principles of the disclosed subject matter can provide countermeasures against static electricity and can be configured in a relatively small size. The lighting emitting device can include both a first conductor pattern and a second conductor pattern on an insulating board. In one example, a first LED chip having a high electrostatic breakdown voltage is electrically connected to the first conductor pattern and a second LED chip having a low electrostatic breakdown voltage is electrically connected to the second conductor pattern. The LED chips can be encapsulated with an encapsulating resin on the insulating board. At least part of the first conductor pattern is exposed at a farther position than a furthest portion of the second conductor pattern from a mounting surface so as to act as a lightning rod.

Abstract: A light emitting device made in accordance with principles of the disclosed subject matter can provide countermeasures against static electricity and can be configured in a relatively small size. The lighting emitting device can include both a first conductor pattern and a second conductor pattern on an insulating board. In one example, a first LED chip having a high electrostatic breakdown voltage is electrically connected to the first conductor pattern and a second LED chip having a low electrostatic breakdown voltage is electrically connected to the second conductor pattern. The LED chips can be encapsulated with an encapsulating resin on the insulating board. At least part of the first conductor pattern is exposed at a farther position than a furthest portion of the second conductor pattern from a mounting surface so as to act as a lightning rod.

Abstract: In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resist is not bonded. Next, an adhesive agent is applied onto a bottom of the lamp house so that the lamp house is bonded onto the substrate through the adhesive agent. A transparent epoxy resin is packed in the frame of the lamp house and hardened by heating to perform resin sealing. Since the resist is bonded onto the surface of copper having a large number of fine irregularities sufficient to ensure a large contact area and excellent in adhesion, separation can be prevented from being caused by thermal stress.

Abstract: A self-lighting type push-button input device according to the presently disclosed subject matter can include a button base portion formed of a transparent material. Holes can be formed in predetermined positions of the button base portion, and spring portions can be formed integrally with the holes by molding transparent silicone rubber with a light diffusing agent incorporated therein. The button base portion serves as a light conducting portion, and the spring portions can uniformly diffuse the light distributed thereto by the light conducting portion, whereby lighting can be effected by a reduced number of light sources, effecting a reduction of size and cost.

Abstract: In conventional self-lighting type push-button input devices there is adopted a construction wherein push-button portions and a base plate are formed using the same material. Since a light conducting function cannot be expected of the base plate, it is necessary to provide the same number of lamps as the number of push-button portions, with consequent increase of size and cost. In a self-lighting type push-button input device according to the present invention, a button base portion can be formed of a transparent material, holes can be formed in predetermined positions of the button base portion, and spring portions can be formed integrally with the holes by molding with use of transparent silicone rubber with a light diffusing agent incorporated therein.

Abstract: In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resist is not bonded. Next, an adhesive agent is applied onto a bottom of the lamp house so that the lamp house is bonded onto the substrate through the adhesive agent. A transparent epoxy resin is packed in the frame of the lamp house and hardened by heating to perform resin sealing. Since the resist is bonded onto the surface of copper having a large number of fine irregularities sufficient to ensure a large contact area and excellent in adhesion, separation can be prevented from being caused by thermal stress.