Patents by Inventor Mahito SHIBUYA

Mahito SHIBUYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230317501
    Abstract: The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.
    Type: Application
    Filed: August 4, 2021
    Publication date: October 5, 2023
    Inventors: Kenya ITO, Takumi YAMADA, Mahito SHIBUYA, Daisuke NAGUMO
  • Patent number: 9738483
    Abstract: A tape sticking apparatus for sticking a masking tape for protecting a peripheral portion of a substrate, such as a wafer, is disclosed. The tape sticking apparatus includes: a substrate holder configured to hold and rotate a substrate; and a tape sticking unit configured to stick a masking tape onto a peripheral portion of the substrate held on the substrate holder.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: August 22, 2017
    Assignees: Ebara Corporation, IS ENGINEERING CO., LTD.
    Inventors: Kenya Ito, Keisuke Uchiyama, Tomiichi Matsui, Mahito Shibuya
  • Publication number: 20160023861
    Abstract: A tape sticking apparatus for sticking a masking tape for protecting a peripheral portion of a substrate, such as a wafer, is disclosed. The tape sticking apparatus includes: a substrate holder configured to hold and rotate a substrate; and a tape sticking unit configured to stick a masking tape onto a peripheral portion of the substrate held on the substrate holder.
    Type: Application
    Filed: May 22, 2015
    Publication date: January 28, 2016
    Inventors: Kenya ITO, Keisuke UCHIYAMA, Tomiichi MATSUI, Mahito SHIBUYA