Patents by Inventor Mahmood A. Siddiqui

Mahmood A. Siddiqui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers
    Patent number: 6489673
    Abstract: A package for a semiconductor die having a header with a cavity. The cavity includes a floor, sidewalls and a plurality of vertically spaced apart rows along the cavity sidewalls, each row including a plurality of spaced apart bond fingers. An electrically insulating membrane, preferably silicon, is disposed over the floor of the cavity, the membrane including a plurality of bumps, a plurality of peripherally located membrane bond pads and an interconnect from each of the bumps to a membrane bond pad. Bond wires are connected between the membrane bond pads and the bond fingers on the plurality of rows. A semiconductor die is provided having a plurality of bond pads, each bond pad contacting one of the bumps on the membrane. The header includes a plurality of alternating layers of electrically conducting material and electrically insulating material, the bond fingers on the header each being coupled to one of the layers of electrically conducting material.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: December 3, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Richard W. Arnold, Lester L. Wilson, Mahmood A. Siddiqui, James A. Forster
  • Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers
    Patent number: 6335226
    Abstract: A package for a semiconductor die having a header with a cavity. The cavity includes a floor, sidewalls and a plurality of vertically spaced apart rows along the cavity sidewalls, each row including a plurality of spaced apart bond fingers. An electrically insulating membrane, preferably silicon, is disposed over the floor of the cavity, the membrane including a plurality of bumps, a plurality of peripherally located membrane bond pads and an interconnect from each of the bumps to a membrane bond pad. Bond wires are connected between the membrane bond pads and the bond fingers on the plurality of rows. A semiconductor die is provided having a plurality of bond pads, each bond pad contacting one of the bumps on the membrane. The header includes a plurality of alternating layers of electrically conducting material and electrically insulating material, the bond fingers on the header each being coupled to one of the layers of electrically conducting material.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: January 1, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Richard W. Arnold, Lester L. Wilson, Mahmood A. Siddiqui, James A. Forster
  • Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers
    Publication number: 20010030360
    Abstract: A package for a semiconductor die having a header with a cavity The cavity includes a floor, sidewalls and a plurality of vertically spaced apart rows along the cavity sidewalls, each row including a plurality of spaced apart bond fingers. An electrically insulating membrane, preferably silicon, is disposed over the floor of the cavity, the membrane including a plurality of bumps, a plurality of peripherally located membrane bond pads and an interconnect from each of the bumps to a membrane bond pad Bond wires are connected between the membrane bond pads and the bond fingers on the plurality of rows. A semiconductor die is provided having a plurality of bond pads, each bond pad contacting one of the bumps on the membrane. The header includes a plurality of alternating layers of electrically conducting material and electrically insulating material, the bond fingers on the header each being coupled to one of the layers of electrically conducting material.
    Type: Application
    Filed: June 15, 2001
    Publication date: October 18, 2001
    Inventors: Richard W. Arnold, Lester L. Wilson, Mahmood A. Siddiqui, James A. Forster