Abstract: A brush cutter rotor comprising cutting tooth assemblies sequentially arranged along a longitudinal axis of the brush cutter rotor, and azimuthally offset to make up intertwined spirals of cutting tooth assemblies. The cutting tooth assemblies of immediately adjacent tracks are arranged to provide for a longitudinal gap in-between, and separating blades are provided within said longitudinal gap on each side of each track comprising one of the cutting tooth assemblies. They form a comb to separate incoming material to a center of the corresponding one of the cutting teeth and away from side edges thereof. The front space before the central portion of cutting teeth is thereby free, exempt from a protective guard. A wear plate can be used in the holding base of the cutting tooth assemblies under each cutting tooth.

Abstract: A substrate integrated waveguide (SIW) slot antenna may include a substrate that may have a first substrate portion with a first permittivity less than unity and a second substrate portion with a second permittivity. The substrate may include a top surface and a bottom surface. The exemplary SIW slot antenna may further include a first conductive layer disposed on the top surface, a second conductive layer disposed on the bottom surface, a transverse slot on the first conducting layer, waveguide sidewalls that may include a plurality of spaced-apart metal-lined vias traversing the substrate, and a microstrip feed line on the first conducting layer.

Abstract: A substrate integrated waveguide (SIW) slot antenna may include a substrate that may have a first substrate portion with a first permittivity less than and a second substrate portion with a second permittivity. The substrate may include a top surface and a bottom surface. The exemplary SIW slot antenna may further include a first conductive layer disposed on the top surface, a second conductive layer disposed on the bottom surface, a transverse slot on the first conducting layer, waveguide sidewalls that may include a plurality of spaced-apart metal-lined vias traversing the substrate, and a microstrip feed line on the first conducting layer.