Patents by Inventor Mahmoud Mohamed Amin EL SABBAGH

Mahmoud Mohamed Amin EL SABBAGH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11457524
    Abstract: A chip includes a plurality of ground conductors that at least partially surround a signal conductor on a same die. The signal conductor carries an interface (e.g., high speed) signal, and the ground conductors filter electromagnetic interference generated by the signal carried by the signal conductor. A chip package includes a plurality of ground pins around a signal pin that carries an interface signal. The ground pins filter electromagnetic interference generated by the signal carried by the signal pin. A printed circuit board includes a plurality of ground conductors around a signal line. The ground conductors are in vias and filter electromagnetic interference generated by an interface signal carried by the signal line.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 27, 2022
    Assignee: NXP B.V.
    Inventors: Mahmoud Mohamed Amin El Sabbagh, Anu Mathew, Siamak Delshadpour
  • Patent number: 11290068
    Abstract: Embodiments of active baluns are disclosed. In an embodiment, an active balun includes input terminals configured to receive a single-ended input signal and a linear redriver configured to transform the single-ended input signal into a differential output signal.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: March 29, 2022
    Assignee: NXP B.V.
    Inventors: Mahmoud Mohamed Amin El Sabbagh, Daniel Meeks
  • Publication number: 20210305947
    Abstract: Embodiments of active baluns are disclosed. In an embodiment, an active balun includes input terminals configured to receive a single-ended input signal and a linear redriver configured to transform the single-ended input signal into a differential output signal.
    Type: Application
    Filed: March 26, 2020
    Publication date: September 30, 2021
    Inventors: Mahmoud Mohamed Amin EL SABBAGH, Daniel MEEKS
  • Publication number: 20200344872
    Abstract: A chip includes a plurality of ground conductors that at least partially surround a signal conductor on a same die. The signal conductor carries an interface (e.g., high speed) signal, and the ground conductors filter electromagnetic interference generated by the signal carried by the signal conductor. A chip package includes a plurality of ground pins around a signal pin that carries an interface signal. The ground pins filter electromagnetic interference generated by the signal carried by the signal pin. A printed circuit board includes a plurality of ground conductors around a signal line. The ground conductors are in vias and filter electromagnetic interference generated by an interface signal carried by the signal line.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 29, 2020
    Inventors: Mahmoud Mohamed Amin EL SABBAGH, Anu MATHEW, Siamak DELSHADPOUR