Patents by Inventor Mahmudul BHUIYAN

Mahmudul BHUIYAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923557
    Abstract: The present disclosure is directed to a battery pack comprising a housing, a plurality of battery cells, a battery cell holder holding the plurality of battery cells, a printed circuit board, a plurality of components requiring exposure, the plurality of components affixed to the printed circuit board, a plurality of adhesion holes positioned to form a boundary about the plurality of components, a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: March 5, 2024
    Assignee: BLACK & DECKER INC.
    Inventors: Mahmudul Bhuiyan, Abhisheka Moturu, Timothy Hennesy, Jason Dunthorn, Michael Varipatis
  • Publication number: 20220328924
    Abstract: A power tool system that includes a power tool having a receptacle for receiving a battery pack, the receptacle including a mechanical interface for mating with a battery pack, a first battery pack having a battery pack housing, the first battery pack housing including a mechanical interface for mating with the power tool, the first battery pack housing having a first width dimension in a direction generally perpendicular to a direction in which the first battery pack mates with the power tool and a second battery pack having a battery pack housing, the second battery pack housing including a mechanical interface for mating with the power tool, the second battery pack housing having a second width dimension in a direction generally perpendicular to a direction in which the second battery pack mates with the power tool, wherein the second width dimension being at least about 1.5 times the first width dimension.
    Type: Application
    Filed: August 14, 2019
    Publication date: October 13, 2022
    Inventors: Nicholas J. GARIBALDI, Luke R. BARTON, Moturu ABHISHEKA, Timothy HENNESY, Michael W. ROBERTS, Jason DUNTHORN, John PALERMO, Steven DERBY, Mahmudul BHUIYAN
  • Publication number: 20220069401
    Abstract: The present disclosure is directed to a battery pack comprising a housing, a plurality of battery cells, a battery cell holder holding the plurality of battery cells, a printed circuit board, a plurality of components requiring exposure, the plurality of components affixed to the printed circuit board, a plurality of adhesion holes positioned to form a boundary about the plurality of components, a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material.
    Type: Application
    Filed: January 25, 2021
    Publication date: March 3, 2022
    Inventors: Mahmudul BHUIYAN, Abhisheka MOTURU, Timothy HENNESY, Jason DUNTHORN, Michael VARIPATIS
  • Publication number: 20210313814
    Abstract: The present disclosure is directed to a battery pack and a power tool system including a power tool, a battery pack and a battery pack charger. The battery pack includes circuitry to prevent electricity drainage from a plurality of battery cells when the battery pack is only partially mated to the power tool or the battery pack charger.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 7, 2021
    Inventors: Mahmudul BHUIYAN, Marc W. McKINLEY, Abhisheka MOTURU, Michael MUILWYK
  • Publication number: 20210143506
    Abstract: The present disclosure is directed to a battery pack comprising a housing, a plurality of battery cells, a battery cell holder holding the plurality of battery cells, a printed circuit board, a plurality of components requiring exposure, the plurality of components affixed to the printed circuit board, a plurality of adhesion holes positioned to form a boundary about the plurality of components, a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 13, 2021
    Inventors: Mahmudul BHUIYAN, Abhisheka MOTURU, Timothy HENNESY, Jason DUNTHORN, Michael VARIPATIS