Patents by Inventor Mahyer Nejat

Mahyer Nejat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of improving mount assembly in a multilayer PCB's
    Publication number: 20030054589
    Abstract: The invention is directed to a chip size package (“CSP”) configuration and method for arranging a CSP configuration which is simple to manufacture, and less costly. The invention includes a structure for a printed circuit board (“PCB”), having at least a single pad for a chip size package (“CSP”) which is square shape. The CSP pad then is rotated 45 degrees in a clockwise or counter clockwise direction from a perpendicular so as to form a diamond shape. Also included is at least a via having a circle shape and wherein the distance between an inner side of the rotated CSP pad, where the inner side is the side closest to the via, and the outer edge of the via is at least 0.1 mm.
    Type: Application
    Filed: January 18, 2002
    Publication date: March 20, 2003
    Applicant: Sony Corporation
    Inventors: Yoshinari Matsuda, Ikuo Jimmy Sanwo, Mahyer Nejat