Patents by Inventor Mai Kondo

Mai Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230407112
    Abstract: A conductive paste composition includes: carbon black having a porous structure and having a DBP oil absorption amount of greater than 240 mL/100 g and a specific surface area of greater than 350 m2/g; and a liquid silicone rubber base composition, in which in a case where the conductive paste composition is dried and cured at 180° C. for two hours to form a conductive film, a content of the carbon black in the conductive film is 4% by mass or greater and 24% by mass or less, and a surface resistance of the conductive film is 1 k? or greater and 9 k? or less.
    Type: Application
    Filed: October 15, 2021
    Publication date: December 21, 2023
    Applicants: Lion Specialty Chemicals Co., Ltd., University of Hyogo
    Inventors: Kasumi MUKAIDA, Hiromu SATO, Katsuyoshi OHARA, Akinori KANETANI, Kazusuke MAENAKA, Mai KONDO, Tokuji YOKOMATSU
  • Publication number: 20100239960
    Abstract: The present invention provides a production method for fuel cell separator, including: preparing a material plate made of stainless steel; press forming the material plate, so that the material plate has a cross section having a concavo-convex shape; and plating only convex of the concavo-convex shape of the material plate with a conductive metal, wherein in the plating, a plating solution holding member, having a plating solution including an ion of the conductive metal, is prepared, the plating solution holding member contacts only the convex, and current is supplied between the solution holding member and the material plate, and in the plating, hydrogen is generated on a surface of the material plate, a passivation film formed on the surface of the material plate is reduced by the hydrogen, and the material plate is plated with the conductive metal.
    Type: Application
    Filed: March 18, 2010
    Publication date: September 23, 2010
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Osamu Ishigami, Mayu Takagi, Mai Kondo