Abstract: A semiconductor module includes a circuit board having a semiconductor element mounted thereon, a lead including a first bonding portion bonded to the semiconductor element via a bonding material and a wiring portion connected to the first bonding portion, and a sealing material that seals the semiconductor element and the lead. The first bonding portion has first and second side surfaces that face each other. The wiring portion has a bent portion connected to the first bonding portion at a side of the first bonding portion at which the first side surface is located. The bent portion is bent at a border between the first bonding portion and the bent portion in a direction away from a lower surface of the first bonding portion. The border is located between the first and second side surfaces of the first bonding portion in a plan view of the lead.

Abstract: A semiconductor module includes: a stacked substrate; a semiconductor element arranged on an upper surface of the first circuit board; a metal wiring board including a first bonding portion bonded to an upper surface of the semiconductor element with a bonding material; and a sealing resin that seals the stacked substrate, the semiconductor element, and the metal wiring board. The first bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The metal wiring board has a first standing portion standing up from one end of the first bonding portion, and a second standing portion standing up from the other end of the first bonding portion. The first standing portion constitutes a part of a wiring path through which a main current flows. The second standing portion constitutes a non-wiring path through which the main current does not flow.

Abstract: A semiconductor module includes a stacked substrate includes an insulating plate and first and second circuit boards arranged on the insulating plate, a semiconductor element arranged on the first circuit board, and a metal wiring board having a first bonding portion bonded to an upper surface of the semiconductor element via a first bonding material. The first bonding portion includes a first plate-shaped portion that has at a lower surface thereof, a boss protruding toward the semiconductor element, and at an upper surface thereof, a first recess at a position corresponding to a position immediately above the boss and multiple second recesses. At the upper surface of the first plate-shaped portion, each of the second recesses has an opening area smaller than an opening area of the first recess.

Abstract: A water softening device includes an electrolysis device, a first circulation flow path and a second circulation flow path, a first sensor, a second sensor, and a controller, wherein the controller controls the electrolysis device to execute a first mode in which the alkaline water is allowed to flow through the first circulation flow path and the acidic water is allowed to flow through the second circulation flow path, and a second mode in which the acidic water is allowed to flow through the first circulation flow path (8A) and the alkaline water is allowed to flow through the second circulation flow path, and controls to stop electrolysis by the electrolysis device based on a detection value of the first sensor or the second sensor in the first mode and the second mode.

Abstract: Provided is a semiconductor module including: an insulating circuit board having a circuit pattern formed in one surface; a semiconductor chip placed in the insulating circuit board; and a wiring portion for electrically connecting the semiconductor chip and the circuit pattern. The wiring portion includes a chip connecting portion connected to the semiconductor chip. A surface of the chip connecting portion includes: a plurality of concave portions; and a flat portion disposed between two concave portions.

Abstract: A cleaning device including a disinfection water supply portion to supply cleaning water with a dissolved disinfection component, and a bubble generation portion to contain bubbles into the cleaning water on a downstream side of the disinfection water supply portion.