Patents by Inventor Mai SAITO

Mai SAITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240266265
    Abstract: A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.
    Type: Application
    Filed: December 26, 2023
    Publication date: August 8, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mai SAITO, Naoyuki KANAI
  • Publication number: 20240234360
    Abstract: A semiconductor module includes a circuit board having a semiconductor element mounted thereon, a lead including a first bonding portion bonded to the semiconductor element via a bonding material and a wiring portion connected to the first bonding portion, and a sealing material that seals the semiconductor element and the lead. The first bonding portion has first and second side surfaces that face each other. The wiring portion has a bent portion connected to the first bonding portion at a side of the first bonding portion at which the first side surface is located. The bent portion is bent at a border between the first bonding portion and the bent portion in a direction away from a lower surface of the first bonding portion. The border is located between the first and second side surfaces of the first bonding portion in a plan view of the lead.
    Type: Application
    Filed: August 24, 2023
    Publication date: July 11, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mai SAITO, Daiki YOSHIDA
  • Publication number: 20240136319
    Abstract: A semiconductor module includes a circuit board having a semiconductor element mounted thereon, a lead including a first bonding portion bonded to the semiconductor element via a bonding material and a wiring portion connected to the first bonding portion, and a sealing material that seals the semiconductor element and the lead. The first bonding portion has first and second side surfaces that face each other. The wiring portion has a bent portion connected to the first bonding portion at a side of the first bonding portion at which the first side surface is located. The bent portion is bent at a border between the first bonding portion and the bent portion in a direction away from a lower surface of the first bonding portion. The border is located between the first and second side surfaces of the first bonding portion in a plan view of the lead.
    Type: Application
    Filed: August 23, 2023
    Publication date: April 25, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mai SAITO, Daiki YOSHIDA
  • Publication number: 20240112991
    Abstract: A semiconductor module includes: a stacked substrate; a semiconductor element arranged on an upper surface of the first circuit board; a metal wiring board including a first bonding portion bonded to an upper surface of the semiconductor element with a bonding material; and a sealing resin that seals the stacked substrate, the semiconductor element, and the metal wiring board. The first bonding portion includes a plate-shaped portion having an upper surface and a lower surface. The metal wiring board has a first standing portion standing up from one end of the first bonding portion, and a second standing portion standing up from the other end of the first bonding portion. The first standing portion constitutes a part of a wiring path through which a main current flows. The second standing portion constitutes a non-wiring path through which the main current does not flow.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mai SAITO, Yoko NAKAMURA
  • Publication number: 20240021569
    Abstract: A semiconductor module includes a stacked substrate includes an insulating plate and first and second circuit boards arranged on the insulating plate, a semiconductor element arranged on the first circuit board, and a metal wiring board having a first bonding portion bonded to an upper surface of the semiconductor element via a first bonding material. The first bonding portion includes a first plate-shaped portion that has at a lower surface thereof, a boss protruding toward the semiconductor element, and at an upper surface thereof, a first recess at a position corresponding to a position immediately above the boss and multiple second recesses. At the upper surface of the first plate-shaped portion, each of the second recesses has an opening area smaller than an opening area of the first recess.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yoko NAKAMURA, Akihiko IWAYA, Mai SAITO, Tsubasa WATAKABE
  • Publication number: 20230183105
    Abstract: A water softening device includes an electrolysis device, a first circulation flow path and a second circulation flow path, a first sensor, a second sensor, and a controller, wherein the controller controls the electrolysis device to execute a first mode in which the alkaline water is allowed to flow through the first circulation flow path and the acidic water is allowed to flow through the second circulation flow path, and a second mode in which the acidic water is allowed to flow through the first circulation flow path (8A) and the alkaline water is allowed to flow through the second circulation flow path, and controls to stop electrolysis by the electrolysis device based on a detection value of the first sensor or the second sensor in the first mode and the second mode.
    Type: Application
    Filed: April 8, 2021
    Publication date: June 15, 2023
    Inventors: Noriyoshi UEYA, Mai SAITO, Yasunari MAEDA
  • Publication number: 20220278039
    Abstract: Provided is a semiconductor module including: an insulating circuit board having a circuit pattern formed in one surface; a semiconductor chip placed in the insulating circuit board; and a wiring portion for electrically connecting the semiconductor chip and the circuit pattern. The wiring portion includes a chip connecting portion connected to the semiconductor chip. A surface of the chip connecting portion includes: a plurality of concave portions; and a flat portion disposed between two concave portions.
    Type: Application
    Filed: May 17, 2022
    Publication date: September 1, 2022
    Inventors: Mai SAITO, Akihiko IWAYA, Yoko NAKAMURA, Tatsuhiko ASAI, Hiromichi GOHARA, Tsubasa WATAKABE, Narumi SATO
  • Publication number: 20220251816
    Abstract: A cleaning device including a disinfection water supply portion to supply cleaning water with a dissolved disinfection component, and a bubble generation portion to contain bubbles into the cleaning water on a downstream side of the disinfection water supply portion.
    Type: Application
    Filed: May 28, 2020
    Publication date: August 11, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasunari MAEDA, Naoki SHIBATA, Sakiho ASA, Mai SAITO