Patents by Inventor Mai YAMAGAMI

Mai YAMAGAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210061820
    Abstract: Metal complex particle including a magnetic material and a particle size adjusting composition containing a hydrophobic polymer, with the magnetic material including a metal complex consisting of a metal ion and a ligand and having both magnetism and fluorescence, and a content of the particle size adjusting composition in the metal complex particle being less than 60 w %.
    Type: Application
    Filed: December 28, 2018
    Publication date: March 4, 2021
    Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.
    Inventors: Mai YAMAGAMI, Shuhei OBINATA, Takeshi WAKIYA, Maasa YAJI
  • Publication number: 20180318970
    Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?or more and 15 ?m or loss, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.
    Type: Application
    Filed: November 18, 2016
    Publication date: November 8, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
  • Publication number: 20180297153
    Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.
    Type: Application
    Filed: November 18, 2016
    Publication date: October 18, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
  • Publication number: 20180297154
    Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part, that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part, after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 nm or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.
    Type: Application
    Filed: November 18, 2016
    Publication date: October 18, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
  • Publication number: 20180301237
    Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.
    Type: Application
    Filed: November 18, 2016
    Publication date: October 18, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA