Patents by Inventor Mai YAMAGAMI
Mai YAMAGAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230118882Abstract: Disclosed is a sensitized magnetic responsive particle including: a magnetic responsive particle having a core particle and at least one magnetic layer disposed on the core particle, the magnetic layer containing microparticles of a magnetic metal and/or an oxide thereof; and a substance that specifically interacts with an analyte, the substance being supported on the magnetic responsive particle, wherein, assuming that a volume and a weight of the core particle are respectively vc and wc, and that a volume and a weight of the magnetic responsive particle are respectively ve and we, the magnetic material density [(we?wc)/(ve?vc)] satisfies the following expression 1: 2.0?(we?wc)/(ve?vc) ??Expression 1 The magnetic responsive particle has a high magnetic collection property in spite of a small particle size. When the magnetic responsive particle is used, a reagent for an immunoassay having excellent magnetic separability and capable of realizing high sensitivity can be provided.Type: ApplicationFiled: March 24, 2021Publication date: April 20, 2023Applicant: SEKISUI MEDICAL CO., LTD.Inventors: Maasa YAJI, Yuya INABA, Shinichiro KITAHARA, Takeshi WAKIYA, Mai YAMAGAMI, Shuhei OBINATA
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Publication number: 20220187287Abstract: Disclosed is a sensitized magnetic responsive particle including: a magnetic responsive particle having a core particle and at least one magnetic layer that is disposed on the core particle and includes microparticles of a magnetic metal and/or an oxide thereof; and a substance that is supported on the magnetic responsive Particle and interacts specifically with an analyte, wherein the coefficient of variation in the weight-average particle size of the magnetic responsive particles is 15% or less. The magnetic responsive particle provided has excellent magnetic separability.Type: ApplicationFiled: March 25, 2020Publication date: June 16, 2022Applicant: SEKISUI MEDICAL CO., LTD.Inventors: Maasa YAJI, Yuya INABA, Shinichiro KITAHARA, Mitsuaki YAMAMOTO, Takeshi WAKIYA, Mai YAMAGAMI, Shuhei OBINATA
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Patent number: 11027374Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 8, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11020825Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 1, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11024439Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 1, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11017916Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: GrantFiled: November 18, 2016Date of Patent: May 25, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Publication number: 20210061820Abstract: Metal complex particle including a magnetic material and a particle size adjusting composition containing a hydrophobic polymer, with the magnetic material including a metal complex consisting of a metal ion and a ligand and having both magnetism and fluorescence, and a content of the particle size adjusting composition in the metal complex particle being less than 60 w %.Type: ApplicationFiled: December 28, 2018Publication date: March 4, 2021Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.Inventors: Mai YAMAGAMI, Shuhei OBINATA, Takeshi WAKIYA, Maasa YAJI
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Publication number: 20180318970Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?or more and 15 ?m or loss, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: ApplicationFiled: November 18, 2016Publication date: November 8, 2018Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
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Publication number: 20180297153Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: ApplicationFiled: November 18, 2016Publication date: October 18, 2018Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
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Publication number: 20180301237Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: ApplicationFiled: November 18, 2016Publication date: October 18, 2018Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA
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Publication number: 20180297154Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part, that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part, after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 nm or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: ApplicationFiled: November 18, 2016Publication date: October 18, 2018Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Mai YAMAGAMI, Satoshi HANEDA, Takeshi WAKIYA, Yasuyuki YAMADA, Saori UEDA, Masao SASADAIRA