Patents by Inventor Maik Schäfer

Maik Schäfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240014599
    Abstract: A module connector for electrically connecting two electric modules comprises a busbar, at least one screw and at least one screw guide. The busbar includes at least one flat face defining a busbar plane, and a through opening extending perpendicularly to the busbar plane and through the busbar. The at least one screw is held in the through hole, rotatable relative to the busbar and slidable parallel to the busbar plane. The at least one screw guide is rotatable relative to the busbar and held at least sectionally in the through opening. The at least one screw guide includes a hole extending parallel to the through opening in which the at least one screw is held at least sectionally.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 11, 2024
    Applicant: TE Connectivity Germany GmbH
    Inventors: Marcus Wolf, Maik Schaefer, Bjoern Hoffmann, Ron Buchholz, Patrick Distler, Manuel Eheim
  • Publication number: 20230141760
    Abstract: A heat retarding arrangement includes a phase change material. The heat retarding arrangement is attachable at or in an electric conductor and passively cools the electric conductor.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 11, 2023
    Applicant: TE Connectivity Germany GmbH
    Inventors: Lukas Schroth, Uwe Hauck, Michael Ludwig, Manuel Eheim, Maik Schaefer, Christopher Muth, Alexander Weber, Markus Eckel
  • Patent number: 11532917
    Abstract: An electrical connector configured to be mated with a mating connector along a mating direction includes a plurality of contact elements each having a contact surface at least partially inclined with respect to the mating direction. The contact elements are spaced apart from each other along a circumferential direction with respect to the mating direction.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: December 20, 2022
    Assignee: TE Connectivity Germany GmbH
    Inventors: Rajesh Kumar, Maik Schaefer, Uwe Hauck, Helge Schmidt, Waldemar Stabroth, Markus Eckel, Frank Ostendorf, Alexander Jakob
  • Publication number: 20220368071
    Abstract: An electrical flat socket contact device includes a contact chamber, a plurality of electrical contact springs arranged in the contact chamber, and a mechanical retaining spring arranged in the contact chamber separately from the electrical contact springs. A tab contact is insertable into the contact chamber. The electrical contact springs electrically contact the tab contact and the mechanical retaining spring mechanically retains the tab contact.
    Type: Application
    Filed: May 11, 2022
    Publication date: November 17, 2022
    Applicant: TE Connectivity Germany GmbH
    Inventors: Caio Carvalho, Kevin Scheer, Harald Ulrich, Maik Schaefer, Stefan Masak, Holger Stange
  • Patent number: 11444289
    Abstract: A contact element for contacting a bipolar plate of a fuel cell stack includes a contact body extending along a longitudinal axis. The contact body has a channel extending along the longitudinal axis and delimited by a pair of channel walls disposed opposite one another in a direction transverse to the longitudinal axis. The channel is adapted to receive a portion of the bipolar plate. The contact body has a contact spring on a first channel wall of the pair of channel walls. The contact spring protrudes into the channel and has a cutting edge directed toward a second channel wall of the pair of channels walls and adapted to contact the bipolar plate.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: September 13, 2022
    Assignee: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Zoran Stjepanovic, Helge Schmidt
  • Publication number: 20220155597
    Abstract: A heads-up projection device configured to be arranged on or in a helmet, for detecting and processing data and for reproducing the data in a virtual image within the view field of an eye of a user of the helmet. The device comprises a housing in which operating elements are arranged for detecting and processing data and/or reproducing the data in an imaged manner, and a combiner panel arranged on the housing. The housing is elongated and has a curved geometry such that the housing can be arranged substantially in the front region of the helmet above the eye(s) of the user, and the combiner panel can be positioned in front of the eye of the user. Also described is a helmet configured for arranging the heads-up projection device on or in the helmet.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 19, 2022
    Inventors: Tim BERGER, Philipp GOLIK, Woldemar NEBYLIZA, Markus KARP, Maik SCHAEFER
  • Patent number: 11303055
    Abstract: A socket contact includes a receptacle receiving a plug contact, a base body surrounding the receptacle at least in sections, a contact element disposed in the receptacle and contacting the plug contact, and a spring device creating a contact normal force at the contact element. The spring device is formed as a part of the base body that surrounds the contact element. The spring device is arranged at a first part and the contact element is arranged at a second part separate from the first part.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: April 12, 2022
    Assignee: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Soenke Sachs, Helge Schmidt
  • Patent number: 11158972
    Abstract: A socket connector assembly is provided and includes a body, a socket connector and a force fit assembly. The socket connector is positioned in the body and includes a socket frame. The socket frame includes an upper side, a lower side positioned opposite the upper side, and a spring assembly connecting the upper side and lower side such that the upper side is moveable relative to the lower side along a height direction. The force fit assembly secures the body to the socket connector.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 26, 2021
    Assignee: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Helge Schmidt
  • Patent number: 11050177
    Abstract: A contact assembly for an electrical connector is provided and generally includes a plurality of first contact bodies and a plurality of second contact bodies. The plurality of first contact bodies include contact surfaces that provide a first contact plane. The plurality of second contact bodies include contact surfaces that provide a second contact plane that is spaced apart from and projecting beyond the first contact plane by a height. The plurality of second contact bodies are elastically deflectable to the first contact plane.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: June 29, 2021
    Assignee: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Helge Schmidt, Harald Kraenzlein
  • Publication number: 20210194193
    Abstract: An electrical connector configured to be mated with a mating connector along a mating direction includes a plurality of contact elements each having a contact surface at least partially inclined with respect to the mating direction. The contact elements are spaced apart from each other along a circumferential direction with respect to the mating direction.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 24, 2021
    Applicant: TE Connectivity Germany GmbH
    Inventors: Rajesh Kumar, Maik Schaefer, Uwe Hauck, Helge Schmidt, Waldermar Stabroth, Markus Eckel, Frank Ostendorf, Alexander Jakob
  • Publication number: 20200274276
    Abstract: A socket contact includes a receptacle receiving a plug contact, a base body surrounding the receptacle at least in sections, a contact element disposed in the receptacle and contacting the plug contact, and a spring device creating a contact normal force at the contact element. The spring device is formed as a part of the base body that surrounds the contact element. The spring device is arranged at a first part and the contact element is arranged at a second part separate from the first part.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 27, 2020
    Applicant: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Soenke Sachs, Helge Schmidt
  • Patent number: 10721567
    Abstract: An electrodynamic sound transducer that includes a chassis, a membrane with a hole in the centre of the membrane, a moving coil, a magnetic system, and a resonator that is placed in the hole in the centre of the membrane.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: July 21, 2020
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventors: Markus Kuhr, Kornelia Kaddig, Maik Schäfer
  • Publication number: 20200067223
    Abstract: A contact assembly for an electrical connector is provided and generally includes a plurality of first contact bodies and a plurality of second contact bodies. The plurality of first contact bodies include contact surfaces that provide a first contact plane. The plurality of second contact bodies include contact surfaces that provide a second contact plane that is spaced apart from and projecting beyond the first contact plane by a height. The plurality of second contact bodies are elastically deflectable to the first contact plane.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 27, 2020
    Applicant: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Helge Schmidt, Harald Kraenzlein
  • Publication number: 20200067224
    Abstract: A socket connector assembly is provided and includes a body, a socket connector and a force fit assembly. The socket connector is positioned in the body and includes a socket frame. The socket frame includes an upper side, a lower side positioned opposite the upper side, and a spring assembly connecting the upper side and lower side such that the upper side is moveable relative to the lower side along a height direction. The force fit assembly secures the body to the socket connector.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Applicant: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Helge Schmidt
  • Publication number: 20200058946
    Abstract: A contact element for contacting a bipolar plate of a fuel cell stack includes a contact body extending along a longitudinal axis. The contact body has a channel extending along the longitudinal axis and delimited by a pair of channel walls disposed opposite one another in a direction transverse to the longitudinal axis. The channel is adapted to receive a portion of the bipolar plate. The contact body has a contact spring on a first channel wall of the pair of channel walls. The contact spring protrudes into the channel and has a cutting edge directed toward a second channel wall of the pair of channels walls and adapted to contact the bipolar plate.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Applicant: TE Connectivity Germany GmbH
    Inventors: Maik Schaefer, Zoran Stjepanovic, Helge Schmidt
  • Publication number: 20180332401
    Abstract: An electrodynamic sound transducer that includes a chassis, a membrane with a hole in the centre of the membrane, a moving coil, a magnetic system, and a resonator that is placed in the hole in the centre of the membrane.
    Type: Application
    Filed: November 23, 2016
    Publication date: November 15, 2018
    Applicant: Sennheiser electronic GmbH & Co. KG
    Inventors: Markus KUHR, Kornelia KADDIG, Maik Schäfer
  • Patent number: 8878074
    Abstract: The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material. At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: November 4, 2014
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Ulrich Moeller, Maik Schaefer
  • Publication number: 20140083756
    Abstract: The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material. At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.
    Type: Application
    Filed: August 17, 2011
    Publication date: March 27, 2014
    Applicant: Conti Temic microelectronic GmbH
    Inventors: Ulrich Moeller, Maik Schaefer
  • Patent number: 8682285
    Abstract: An emergency call unit for a vehicle includes not only a detection unit, a position-finding unit and a control unit, but also a transmission unit for the repeated transmission of a locating signal to a rescue worker. In this context, the locating signal may correspond to the position of the vehicle, and the transmission of the locating signal is initiated by a trigger event. By way of example, the trigger event is a request from a rescue worker or is the detection of an accident.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: March 25, 2014
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Ulrich Stählin, Ralf Merzbacher, Marc Menzel, Carsten Birke, Maik Schäfer, Ulrich Möller
  • Patent number: 8341895
    Abstract: A mounting device for solar modules having a large aspect ratio in a parallel arrangement on a flat horizontal substrate includes mounting rails having through-holes at predetermined locations. Insertion elements are attached to the mounting rails at the through-holes. Each insertion element includes a one-piece shaped element having a contiguous surface interrupted by an insertion slit configured to receive a lengthwise edge area of a solar module, the insertion slit extending at a predetermined insertion angle. A plastic wedge is configured to secure the received lengthwise edge area of the solar module in the insertion slit.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: January 1, 2013
    Assignee: Solon SE
    Inventors: Sascha Oliver Schwarze, Maik Schaefer