Patents by Inventor Maik Schaefer
Maik Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240405467Abstract: A high current connector includes a housing, a screw and a screw head cover. The screw extends along a screw axis and has a screw head. The housing has a first receptacle extending along the screw axis and a receptacle opening. The screw head and the cover are arranged in the first receptacle. The cover is on a side that faces the receptacle opening and covers the screw head to electrically isolate the screw. The screw head cover has a cover portion extending outwards in the radial direction and a support portion arranged radially outside on the cover portion extending about the screw axis. The first receptacle has a receptacle internal wall facing the support portion. The support portion has an outer circumferential side resting against the receptacle internal wall and supporting the screw in the radial direction.Type: ApplicationFiled: May 30, 2024Publication date: December 5, 2024Inventors: Marcus WOLF, Jens HUBER, Bjoern HOFFMANN, Ron BUCHHOLZ, Alexander WEBER, Maik SCHAEFER, Manuel EHEIM, Patrick DISTLER
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Publication number: 20240209855Abstract: A vacuum pump in accordance with the invention, in particular a scroll vacuum pump, comprises a first spiral element that has a first wall that extends spirally about a first axis, that extends in an axial direction from a first support, and that has a first free end face facing away from the first support, and a second spiral element that has a second wall that extends spirally about a second axis, that extends in the axial direction from a second support, and that has a second free end face facing away from the second support, wherein the first spiral element and the second spiral element are movable relative to one another and are arranged such that the first wall and the second wall sealingly engage into one another while forming pumping spaces, wherein the free end face of at least one of the walls has a recess, in particular a groove, which extends in a longitudinal direction of the wall and in which at least one seal is movably arranged, and wherein the recess is laterally bounded by at least one innerType: ApplicationFiled: December 19, 2023Publication date: June 27, 2024Applicant: Pfeiffer Vacuum Technology AGInventors: Jonas BECKER, Jan HOFMANN, Sebastian LATTA, Heiko SCHAEFER, Maik SCHAEFER, Wolfgang SOEHNGEN
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Publication number: 20240014599Abstract: A module connector for electrically connecting two electric modules comprises a busbar, at least one screw and at least one screw guide. The busbar includes at least one flat face defining a busbar plane, and a through opening extending perpendicularly to the busbar plane and through the busbar. The at least one screw is held in the through hole, rotatable relative to the busbar and slidable parallel to the busbar plane. The at least one screw guide is rotatable relative to the busbar and held at least sectionally in the through opening. The at least one screw guide includes a hole extending parallel to the through opening in which the at least one screw is held at least sectionally.Type: ApplicationFiled: July 5, 2023Publication date: January 11, 2024Applicant: TE Connectivity Germany GmbHInventors: Marcus Wolf, Maik Schaefer, Bjoern Hoffmann, Ron Buchholz, Patrick Distler, Manuel Eheim
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Publication number: 20230141760Abstract: A heat retarding arrangement includes a phase change material. The heat retarding arrangement is attachable at or in an electric conductor and passively cools the electric conductor.Type: ApplicationFiled: November 10, 2022Publication date: May 11, 2023Applicant: TE Connectivity Germany GmbHInventors: Lukas Schroth, Uwe Hauck, Michael Ludwig, Manuel Eheim, Maik Schaefer, Christopher Muth, Alexander Weber, Markus Eckel
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Patent number: 11532917Abstract: An electrical connector configured to be mated with a mating connector along a mating direction includes a plurality of contact elements each having a contact surface at least partially inclined with respect to the mating direction. The contact elements are spaced apart from each other along a circumferential direction with respect to the mating direction.Type: GrantFiled: December 16, 2020Date of Patent: December 20, 2022Assignee: TE Connectivity Germany GmbHInventors: Rajesh Kumar, Maik Schaefer, Uwe Hauck, Helge Schmidt, Waldemar Stabroth, Markus Eckel, Frank Ostendorf, Alexander Jakob
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Publication number: 20220368071Abstract: An electrical flat socket contact device includes a contact chamber, a plurality of electrical contact springs arranged in the contact chamber, and a mechanical retaining spring arranged in the contact chamber separately from the electrical contact springs. A tab contact is insertable into the contact chamber. The electrical contact springs electrically contact the tab contact and the mechanical retaining spring mechanically retains the tab contact.Type: ApplicationFiled: May 11, 2022Publication date: November 17, 2022Applicant: TE Connectivity Germany GmbHInventors: Caio Carvalho, Kevin Scheer, Harald Ulrich, Maik Schaefer, Stefan Masak, Holger Stange
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Patent number: 11444289Abstract: A contact element for contacting a bipolar plate of a fuel cell stack includes a contact body extending along a longitudinal axis. The contact body has a channel extending along the longitudinal axis and delimited by a pair of channel walls disposed opposite one another in a direction transverse to the longitudinal axis. The channel is adapted to receive a portion of the bipolar plate. The contact body has a contact spring on a first channel wall of the pair of channel walls. The contact spring protrudes into the channel and has a cutting edge directed toward a second channel wall of the pair of channels walls and adapted to contact the bipolar plate.Type: GrantFiled: August 13, 2019Date of Patent: September 13, 2022Assignee: TE Connectivity Germany GmbHInventors: Maik Schaefer, Zoran Stjepanovic, Helge Schmidt
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Publication number: 20220155597Abstract: A heads-up projection device configured to be arranged on or in a helmet, for detecting and processing data and for reproducing the data in a virtual image within the view field of an eye of a user of the helmet. The device comprises a housing in which operating elements are arranged for detecting and processing data and/or reproducing the data in an imaged manner, and a combiner panel arranged on the housing. The housing is elongated and has a curved geometry such that the housing can be arranged substantially in the front region of the helmet above the eye(s) of the user, and the combiner panel can be positioned in front of the eye of the user. Also described is a helmet configured for arranging the heads-up projection device on or in the helmet.Type: ApplicationFiled: March 26, 2020Publication date: May 19, 2022Inventors: Tim BERGER, Philipp GOLIK, Woldemar NEBYLIZA, Markus KARP, Maik SCHAEFER
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Patent number: 11303055Abstract: A socket contact includes a receptacle receiving a plug contact, a base body surrounding the receptacle at least in sections, a contact element disposed in the receptacle and contacting the plug contact, and a spring device creating a contact normal force at the contact element. The spring device is formed as a part of the base body that surrounds the contact element. The spring device is arranged at a first part and the contact element is arranged at a second part separate from the first part.Type: GrantFiled: May 12, 2020Date of Patent: April 12, 2022Assignee: TE Connectivity Germany GmbHInventors: Maik Schaefer, Soenke Sachs, Helge Schmidt
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Patent number: 11158972Abstract: A socket connector assembly is provided and includes a body, a socket connector and a force fit assembly. The socket connector is positioned in the body and includes a socket frame. The socket frame includes an upper side, a lower side positioned opposite the upper side, and a spring assembly connecting the upper side and lower side such that the upper side is moveable relative to the lower side along a height direction. The force fit assembly secures the body to the socket connector.Type: GrantFiled: August 22, 2019Date of Patent: October 26, 2021Assignee: TE Connectivity Germany GmbHInventors: Maik Schaefer, Helge Schmidt
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Patent number: 11050177Abstract: A contact assembly for an electrical connector is provided and generally includes a plurality of first contact bodies and a plurality of second contact bodies. The plurality of first contact bodies include contact surfaces that provide a first contact plane. The plurality of second contact bodies include contact surfaces that provide a second contact plane that is spaced apart from and projecting beyond the first contact plane by a height. The plurality of second contact bodies are elastically deflectable to the first contact plane.Type: GrantFiled: August 21, 2019Date of Patent: June 29, 2021Assignee: TE Connectivity Germany GmbHInventors: Maik Schaefer, Helge Schmidt, Harald Kraenzlein
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Publication number: 20210194193Abstract: An electrical connector configured to be mated with a mating connector along a mating direction includes a plurality of contact elements each having a contact surface at least partially inclined with respect to the mating direction. The contact elements are spaced apart from each other along a circumferential direction with respect to the mating direction.Type: ApplicationFiled: December 16, 2020Publication date: June 24, 2021Applicant: TE Connectivity Germany GmbHInventors: Rajesh Kumar, Maik Schaefer, Uwe Hauck, Helge Schmidt, Waldermar Stabroth, Markus Eckel, Frank Ostendorf, Alexander Jakob
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Publication number: 20200274276Abstract: A socket contact includes a receptacle receiving a plug contact, a base body surrounding the receptacle at least in sections, a contact element disposed in the receptacle and contacting the plug contact, and a spring device creating a contact normal force at the contact element. The spring device is formed as a part of the base body that surrounds the contact element. The spring device is arranged at a first part and the contact element is arranged at a second part separate from the first part.Type: ApplicationFiled: May 12, 2020Publication date: August 27, 2020Applicant: TE Connectivity Germany GmbHInventors: Maik Schaefer, Soenke Sachs, Helge Schmidt
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Patent number: 10721567Abstract: An electrodynamic sound transducer that includes a chassis, a membrane with a hole in the centre of the membrane, a moving coil, a magnetic system, and a resonator that is placed in the hole in the centre of the membrane.Type: GrantFiled: November 23, 2016Date of Patent: July 21, 2020Assignee: Sennheiser electronic GmbH & Co. KGInventors: Markus Kuhr, Kornelia Kaddig, Maik Schäfer
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Publication number: 20200067224Abstract: A socket connector assembly is provided and includes a body, a socket connector and a force fit assembly. The socket connector is positioned in the body and includes a socket frame. The socket frame includes an upper side, a lower side positioned opposite the upper side, and a spring assembly connecting the upper side and lower side such that the upper side is moveable relative to the lower side along a height direction. The force fit assembly secures the body to the socket connector.Type: ApplicationFiled: August 22, 2019Publication date: February 27, 2020Applicant: TE Connectivity Germany GmbHInventors: Maik Schaefer, Helge Schmidt
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Publication number: 20200067223Abstract: A contact assembly for an electrical connector is provided and generally includes a plurality of first contact bodies and a plurality of second contact bodies. The plurality of first contact bodies include contact surfaces that provide a first contact plane. The plurality of second contact bodies include contact surfaces that provide a second contact plane that is spaced apart from and projecting beyond the first contact plane by a height. The plurality of second contact bodies are elastically deflectable to the first contact plane.Type: ApplicationFiled: August 21, 2019Publication date: February 27, 2020Applicant: TE Connectivity Germany GmbHInventors: Maik Schaefer, Helge Schmidt, Harald Kraenzlein
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Publication number: 20200058946Abstract: A contact element for contacting a bipolar plate of a fuel cell stack includes a contact body extending along a longitudinal axis. The contact body has a channel extending along the longitudinal axis and delimited by a pair of channel walls disposed opposite one another in a direction transverse to the longitudinal axis. The channel is adapted to receive a portion of the bipolar plate. The contact body has a contact spring on a first channel wall of the pair of channel walls. The contact spring protrudes into the channel and has a cutting edge directed toward a second channel wall of the pair of channels walls and adapted to contact the bipolar plate.Type: ApplicationFiled: August 13, 2019Publication date: February 20, 2020Applicant: TE Connectivity Germany GmbHInventors: Maik Schaefer, Zoran Stjepanovic, Helge Schmidt
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Publication number: 20180332401Abstract: An electrodynamic sound transducer that includes a chassis, a membrane with a hole in the centre of the membrane, a moving coil, a magnetic system, and a resonator that is placed in the hole in the centre of the membrane.Type: ApplicationFiled: November 23, 2016Publication date: November 15, 2018Applicant: Sennheiser electronic GmbH & Co. KGInventors: Markus KUHR, Kornelia KADDIG, Maik Schäfer
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Patent number: 8878074Abstract: The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material. At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.Type: GrantFiled: August 17, 2011Date of Patent: November 4, 2014Assignee: Conti Temic microelectronic GmbHInventors: Ulrich Moeller, Maik Schaefer
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Publication number: 20140083756Abstract: The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material. At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.Type: ApplicationFiled: August 17, 2011Publication date: March 27, 2014Applicant: Conti Temic microelectronic GmbHInventors: Ulrich Moeller, Maik Schaefer