Abstract: A ceramic electronic device includes a multilayer chip having a multilayer portion in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. The multilayer chip has a side margin outside a capacity section. The multilayer chip has cover layers on an upper face and a lower face of a capacity section. Each of the side margin and the cover layers has, on a side of an outer surface, a high concentration portion of a subcomponent of at least one of Si, Mn, Cu, Fe, V, Ni, B, Mg, Ho, Dy, Er, Tm, Yb, Gd, Li, Co, Sm and Y. A concentration of the subcomponent of the high concentration portion is higher than that of a portion closer to the capacity section than the high concentration portion.

Abstract: A ceramic electronic component, in which a dimension in a first direction being equal to or greater than 1.3 times a dimension in a second direction perpendicular to the first direction, includes a multilayer chip having a plurality of internal electrode layers stacked in the first direction; and a pair of external electrodes provided on a first end surface and a second end surface, wherein in each of the plurality of internal electrode layers, a width of a connecting portion thereof connected to the corresponding external electrode in the second direction is narrower than a width of other regions of the internal electrode layer, and wherein in at least two adjacent internal electrode layers connected to the same one of the pair of external electrodes, side edges of the connecting portions in the second direction are shifted in position with respect to each other in the second direction.

Abstract: A ceramic electronic component includes a multilayer body having internal electrode layers and dielectric layers alternately laminated, and a pair of external electrodes covering each of a pair of first corner portions extending between one surface and a pair of opposing surfaces adjacent to the one surface, wherein the pair of first corner portions each have an arc shape projecting outward when the laminating direction is viewed from front, each of the plurality of internal electrode layers has a substantially rectangular outer edge when the laminating direction is viewed from front, and each of the plurality of internal electrode layers includes a second corner portion exposed to one of the pair of first corner portions so as to be in contact with one of the pair of external electrodes, the arc-shaped second corner portion being positioned at one end of a side alongside the one surface of four sides.

Abstract: A ceramic electronic component includes a multilayer body in which internal electrodes are stacked in a first axis direction, the multilayer body having side faces perpendicular to a second axis direction that is orthogonal to the first axis direction, ends of the internal electrodes being positioned at the side faces and aligned within a range of 0.5 ?m in the second axis direction; and side margin portions covering the side faces, respectively, the side margin portions including a ceramic polycrystal as a main component and glass grains dispersed in the polycrystal, a total volume ratio of the glass grains with respect to the polycrystal being 1% or more and 20% or less, a median diameter of the glass grains is 0.20 ?m or more and less than 0.75 ?m, and is 90% or more of a median diameter of crystal grains constituting the polycrystal.