Patents by Inventor Majorio Arafiles Rafanan

Majorio Arafiles Rafanan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Treatment of a self-assembled monolayer on a dielectric layer for improved epoxy adhesion
    Patent number: 9085457
    Abstract: This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: July 21, 2015
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: David Leslie Heald, Majorio Arafiles Rafanan
  • TREATMENT OF A SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC LAYER FOR IMPROVED EPOXY ADHESION
    Publication number: 20120229709
    Abstract: This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 13, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: David Leslie Heald, Majorio Arafiles Rafanan