Patents by Inventor Makarand Shinde
Makarand Shinde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110082599Abstract: A system for optimizing utility usage is described. The system comprises a monitoring device adapted to be connected to a utility point, a utility consuming device and a central processing unit (CPU). The monitoring device is configured to regulate utility usage information of the utility consuming device and is further configured to assign a unique identifier to the monitoring device. The monitoring device comprises a measurement circuit for measuring utility usage information, wherein the measurement circuit is coupled to the utility point. The monitoring device is configured to communicate with the CPU, wherein the monitoring device is configured to transmit utility usage information of the utility consuming device to the CPU on the unique identifier and wherein the monitoring device is configured to receive utility usage information of the utility consuming device and wherein the CPU is configured to process the utility usage information based on the unique identifier.Type: ApplicationFiled: October 6, 2010Publication date: April 7, 2011Inventors: Makarand Shinde, William Brisko, Nitu Shinde
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Publication number: 20080094088Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: December 21, 2007Publication date: April 24, 2008Inventors: Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Publication number: 20080042668Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.Type: ApplicationFiled: October 23, 2007Publication date: February 21, 2008Inventors: Benjamin Eldridge, Gary Grube, Eric Hobbs, Gaetan Mathieu, Makarand Shinde, Alexander Slocum, A. Sporck, Thomas Watson
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Publication number: 20070229102Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.Type: ApplicationFiled: June 12, 2007Publication date: October 4, 2007Inventors: Benjamin Eldridge, Barbara Vasquez, Makarand Shinde, Gaetan Mathieu, A. Sporck
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Publication number: 20070139060Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: October 10, 2006Publication date: June 21, 2007Inventors: Rod Martens, Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Publication number: 20070126435Abstract: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.Type: ApplicationFiled: December 2, 2005Publication date: June 7, 2007Applicant: FormFactor, Inc.Inventors: Benjamin Eldridge, Eric Hobbs, Gaetan Mathieu, Makarand Shinde, Alexander Slocum
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Publication number: 20060290367Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.Type: ApplicationFiled: June 24, 2005Publication date: December 28, 2006Inventors: Eric Hobbs, Benjamin Eldridge, Lunyu Ma, Gaetan Mathieu, Steven Murphy, Makarand Shinde, Alexander Slocum
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Publication number: 20060255814Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.Type: ApplicationFiled: December 30, 2005Publication date: November 16, 2006Applicant: FORMFACTORInventors: Benjamin Eldridge, Gary Grube, Eric Hobbs, Gaetan Mathieu, Makarand Shinde, Alexander Slocum, A. Sporck, Thomas Watson
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Publication number: 20060244470Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Inventors: Makarand Shinde, Richard Larder, Timothy Cooper, Ravindra Shenoy, Benjamin Eldridge
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Publication number: 20060238211Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: July 3, 2006Publication date: October 26, 2006Inventors: Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Patent number: 7119564Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: August 30, 2005Date of Patent: October 10, 2006Assignee: FormFactor, Inc.Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Patent number: 7071714Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: November 2, 2001Date of Patent: July 4, 2006Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Publication number: 20060001440Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: August 30, 2005Publication date: January 5, 2006Inventors: Rod Martens, Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Publication number: 20050277323Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.Type: ApplicationFiled: June 15, 2004Publication date: December 15, 2005Applicant: FormFactor, Inc.Inventors: Benjamin Eldridge, Barbara Vasquez, Makarand Shinde, Gaetan Mathieu, A. Sporck
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Patent number: 6972578Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: May 31, 2002Date of Patent: December 6, 2005Assignee: FormFactor, Inc.Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Publication number: 20050156611Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: ApplicationFiled: February 2, 2004Publication date: July 21, 2005Applicant: FormFactor, Inc.Inventors: Makarand Shinde, Richard Larder, Timothy Cooper, Ravindra Shenoy, Benjamin Eldridge
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Publication number: 20050140381Abstract: A probe card assembly includes a printed circuit board with tester contacts for making electrical connections to a semiconductor tester. The probe card assembly also includes a probe head assembly with probes for contacting a semiconductor device under test. One or more daughter cards is mounted to the printed circuit board such that they are substantially coplanar with the printed circuit board. The daughter cards may contain a circuit for processing test data, including test signals to be input into the semiconductor and/or response signals generated by the semiconductor device in response to the test signals.Type: ApplicationFiled: February 15, 2005Publication date: June 30, 2005Inventors: A. Sporck, Makarand Shinde
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Publication number: 20030085721Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: November 2, 2001Publication date: May 8, 2003Inventors: Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Publication number: 20030085723Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: May 31, 2002Publication date: May 8, 2003Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu