Patents by Inventor Makato KONDO

Makato KONDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROLESS COPPER PLATING SOLUTION
    Publication number: 20150024139
    Abstract: Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Inventors: Katsuhiro YOSHIDA, Yoshiyuki HAKIRI, Makato KONDO