Patents by Inventor Maki Fujisawa

Maki Fujisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948900
    Abstract: A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 2, 2024
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki Yonetsu, Seiichi Suenaga, Sachiko Fujisawa, Takayuki Naba
  • Patent number: D294743
    Type: Grant
    Filed: December 26, 1985
    Date of Patent: March 15, 1988
    Assignee: Kyusyu Hitachi Maxell, Ltd.
    Inventors: Yasusuke Seki, Masaru Komiya, Maki Fujisawa, Misako Takahashi
  • Patent number: D296929
    Type: Grant
    Filed: October 23, 1985
    Date of Patent: July 26, 1988
    Assignee: Kyusyu Hitachi Maxell, Ltd.
    Inventors: Yoshimasa Yokoyama, Kiyonori Furukawa, Maki Fujisawa
  • Patent number: D317367
    Type: Grant
    Filed: June 17, 1988
    Date of Patent: June 4, 1991
    Assignee: Kyushu Hitachi Maxell, Ltd.
    Inventors: Maki Fujisawa, Misako Takahashi, Kazue Tsurui, Yuko Urushihara, Moritaka Taniguchi, Kazuko Kubomura, Chiho Yokota, Akiko Kubota, Kiwako Nagai