Abstract: The present disclosure relates to a display device having, between members, a pressure-sensitive adhesive layer having a maximum value of loss tangent tan ? (f) of 0.9 or more at 25° C. and a frequency f (Hz) of 100 to 300 Hz and a pressure-sensitive adhesive strength of 500 gf/inch or more as measured by a specific method. The display device of the present disclosure can improve the operability and reliability of a display device having a haptic function, and can provide sufficient close adhesion between members for practical use in the display device and sufficiently improve the reliability and durability thereof.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G?), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A?) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

Abstract: The pressure-sensitive adhesive layer forming organopolysiloxane composition of this disclosure is hydrosilylation reaction curable, wherein 1 mass % or more of a resin component is (b2) an organopolysiloxane resin having a weight average molecular weight (Mw) as measured in terms of standard polystyrene by GPC using toluene that is less than 4000, and the value obtained by dividing Tg+120(° C.) of the pressure-sensitive adhesive layer obtained by curing by Tg?+120(° C.) of the composition (pressure-sensitive adhesive layer), in which component (b2) is substituted by a resin with Mw 4000 or higher is less than 1.0. When used as a pressure-sensitive adhesive layer and when a specific resin component/polymer component ratio is selected to achieve a pressure-sensitive adhesive strength, the glass transition temperature (Tg) of the pressure-sensitive adhesive layer can be further reduced, resulting in a strong pressure-sensitive adhesive force and a low Tg at the same time.

Abstract: A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of maintaining high transparency over an extended period of time without developing problems such as discoloration or coloration, even when subjected to long-term aging at a high temperature and even when exposed to high-energy rays such as UV rays over an extended period of time. The curing-reactive organopolysiloxane composition can be cured via hydrosilylation reaction. A content of platinum-based metal among a solid content is in the range of from 0.1 to 50 ppm. An adhesive force of a cured layer with a thickness of 50 ?m obtained by curing the composition is not less than 0.02N/25 mm. A pressure-sensitive adhesive layer obtained by curing the composition, and an electronic part or a display device using the same, are also provided.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having a high shear storage elastic modulus and stress at 500% strain and having excellent adhesive strength. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin having 9 mol % or less of hydroxyl groups and the like, and being a mixture of (b1) an organopolysiloxane resin having a (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a (Mw) of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0 A pressure-sensitive adhesive layer obtained by curing the composition has a shear storage elastic modulus G? at 25° C. of 3.5 MPa or more, and a stress at 500% strain of 0.25 MPa or more.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having practically sufficient curability and pressure-sensitive adhesive strength, and a relatively high shear storage elastic modulus and tensile stress at 500% strain. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having a content of vinyl portions in alkenyl groups within a range of 0.02 to 0.30 mass %; (B) an organopolysiloxane resin having a content of hydroxyl groups and the like of 9 mol % or less, and a molecular weight of 4500 or more; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0. A pressure-sensitive adhesive layer obtained by curing the organopolysiloxane composition has a shear storage elastic modulus G? at 25° C. of 1.0 MPa or more and a stress at 500% strain of 0.50 MPa or more.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having excellent curing properties, a wide range of designable viscoelastic properties such as storage elastic modulus (G?) and the like, and practically sufficient pressure-sensitive adhesive strength and tensile adhesive strength. The organopolysiloxane composition comprises: (A) an organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin with 9 mol % or less of hydroxyl groups or the like relative to all silicon atoms in a molecule or resin mixture thereof; (C) an organohydrogenpolysiloxane; (D) an organic silicon compound having an alkenyl group; and (E) a hydrosilylation reaction catalyst. A ratio (molar ratio) of the substance amount of SiH groups in component (C) relative to the sum of alkenyl groups in components (A), (B) and (D) is 1.0 or less.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer capable of a wide range of storage elastic modulus (G?) at low temperatures, and with excellent curability and adhesion. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like and is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 3.0, and the shear storage elastic modulus G? at ?20° C. of a PSA pressure sensitive adhesive layer obtained by curing the composition is within a range of 0.77 to 50.00 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G?), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A?) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G?) at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.

Abstract: A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of maintaining high transparency over an extended period of time without developing problems such as discoloration or coloration, even when subjected to long-term aging at a high temperature and even when exposed to high-energy rays such as UV rays over an extended period of time. The curing-reactive organopolysiloxane composition can be cured via hydrosilylation reaction. A content of platinum-based metal among a solid content is in the range of from 0.1 to 50 ppm. An adhesive force of a cured layer with a thickness of 50 ?m obtained by curing the composition is not less than 0.02N/25 mm. A pressure-sensitive adhesive layer obtained by curing the composition, and an electronic part or a display device using the same, are also provided.

Abstract: A flexible laminate, in which it is possible to achieve both flexibility and durability, is disclosed. A flexible display using the flexible laminate is also disclosed. The flexible laminate includes one or more units of a laminate structure in which two hard layers interposing one or more intermediate layers therebetween are bonded together as one unit. The intermediate layer has viscoelasticity. When the flexible laminate is bent, a neutral plane is formed in each inner portion of the hard layers that are bonded together to interpose the intermediate layer therebetween.

Abstract: A curable organopolysiloxane composition with excellent handling workability and curability by a hydrosilylation reaction, which forms a pressure sensitive adhesive layer that firmly adheres to a base material of a display device or the like, is disclosed. An application thereof is also disclosed. The organopolysiloxane composition with pressure sensitive adhesive layer forming properties is a hydrosilylation reactive organopolysiloxane composition where a molar ratio (e.g. SiH/Vi ratio) of an SiH group in an organopolysiloxane (C) with regard to a sum of an amount of alkenyl groups in an organopolysiloxane (A) having an alkenyl group and an organopolysiloxane resin (B) is at an amount of 20 to 60.

Abstract: A flexible laminate for which increased flexibility and improved durability can coexist, and a flexible display provided with same, are disclosed. The flexible laminate has at least one unit of a laminated structure in which two hard layers closely adhere to each other with at least one intermediate layer therebetween. When the flexible laminate is bent, neutral planes are formed inside each of the hard layers that closely adhere to each other with the intermediate layer therebetween. The flexible laminate satisfies the following expression: a×ln(tan ?×ET/0.01)?100. In the expression, a is any value ranging from 200 to 2,000, tan ? represents a loss factor for a substance configuring the intermediate layer, and ET represents an elastic modulus (MPa) of the substance configuring the intermediate layer.

Abstract: A flexible laminate, in which it is possible to achieve both flexibility and durability, is disclosed. A flexible display using the flexible laminate is also disclosed. The flexible laminate includes one or more units of a laminate structure in which two hard layers interposing one or more intermediate layers therebetween are bonded together as one unit. The intermediate layer has viscoelasticity. When the flexible laminate is bent, a neutral plane is formed in each inner portion of the hard layers that are bonded together to interpose the intermediate layer therebetween.

Abstract: A flexible laminate for which increased flexibility and improved durability can coexist, and a flexible display provided with same, are disclosed. The flexible laminate has at least one unit of a laminated structure in which two hard layers closely adhere to each other with at least one intermediate layer therebetween. When the flexible laminate is bent, neutral planes are formed inside each of the hard layers that closely adhere to each other with the intermediate layer therebetween. The flexible laminate satisfies the following expression: a×In (tan ?×ET/0.01)?100. In the expression, a is any value ranging from 200 to 2,000, tan ? represents a loss factor for a substance configuring the intermediate layer, and ET represents an elastic modulus (MPa) of the substance configuring the intermediate layer.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R12SiO2/2)b (R2SiO3/2)c (R3SiO3/2)d, wherein, R1 are the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two R1 in a molecule are the alkenyl groups; R2 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; R3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01?a?0.5, 0?b?0.7, 0.01?c<0.7, 0.1?d<0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R12SiO2/2)b (R2SiO3/2)c (R3SiO3/2)d, wherein, R1 are the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two R1 in a molecule are the alkenyl groups; R2 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; R3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01?a?0.5, 0?b?0.7, 0.01?c<0.7, 0.1?d<0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organo polysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.