Patents by Inventor Maki Kumagai

Maki Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10782612
    Abstract: Disclosed are a polysulfone amide compound having a repeating unit represented by formula (1) (in formula (1), R1-R8 each independently represent a hydrogen atom or a monovalent organic group, X represents a divalent linking group which is not conjugated with a benzene ring to be linked thereto, and Y represents a divalent aromatic residue), and a resin composition comprising the polysulfone amide compound.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: September 22, 2020
    Assignee: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Takanori Koizumi, Maki Kumagai
  • Publication number: 20180273685
    Abstract: Disclosed are a polysulfone amide compound having a repeating unit represented by formula (1) (in formula (1), R1-R8 each independently represent a hydrogen atom or a monovalent organic group, X represents a divalent linking group which is not conjugated with a benzene ring to be linked thereto, and Y represents a divalent aromatic residue), and a resin composition comprising the polysulfone amide compound.
    Type: Application
    Filed: October 6, 2016
    Publication date: September 27, 2018
    Inventors: Takanori KOIZUMI, Maki KUMAGAI
  • Patent number: 9857685
    Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: January 2, 2018
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoko Imaizumi, Yoshiyuki Ono, Takanori Koizumi, Maki Kumagai, Shinya Inagaki
  • Publication number: 20170102614
    Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.
    Type: Application
    Filed: June 9, 2015
    Publication date: April 13, 2017
    Inventors: Naoko Imaizumi, Yoshiyuki Ono, Takanori Koizumi, Maki Kumagai, Shinya Inagaki