Abstract: According to one embodiment, a semiconductor storage device includes: a first stacked body in which a plurality of conductive layers are stacked via a first insulating layer, the first stacked body having a first stepped portion and a second stepped portion in which end portions of the plurality of conductive layers are formed in a step shape in a lower layer; a second stacked body in which a plurality of second insulating layers are stacked via a third insulating layer, the second stacked body having a third stepped portion in which end portions of the plurality of second insulating layers in an identical level as the conductive layers forming the first stepped portion are formed in a step shape. The first stepped portion and the third stepped portion oppose each other, and the second stepped portion and the third stepped portion overlap each other at least partially in a top view.

Abstract: According to one embodiment, a semiconductor storage device includes: a first stacked body in which a plurality of conductive layers are stacked via a first insulating layer, the first stacked body having a first stepped portion and a second stepped portion in which end portions of the plurality of conductive layers are formed in a step shape in a lower layer; a second stacked body in which a plurality of second insulating layers are stacked via a third insulating layer, the second stacked body having a third stepped portion in which end portions of the plurality of second insulating layers in an identical level as the conductive layers forming the first stepped portion are formed in a step shape. The first stepped portion and the third stepped portion oppose each other, and the second stepped portion and the third stepped portion overlap each other at least partially in a top view.

Abstract: A semiconductor device includes a base body, an insulating layer, first contacts and a first wiring. The insulating layer is disposed above the base body. The first contacts are disposed in the insulating layer. The first contacts are in contact with the base body. The first wiring is disposed around the first contacts. The first wiring has a lower height than the first contacts have. The first wiring includes convex portions in a part of a bottom portion thereof.

Abstract: According to one embodiment, first, a core pattern is formed above a hard mask layer that is formed above a process object. Then, a spacer film is formed above the hard mask layer. Next, the spacer film is etch-backed. Subsequently, an embedded layer is embedded between the core patterns whose peripheral areas are surrounded by the spacer film. Then, the core pattern and the embedded layer are removed simultaneously. Subsequently, using the spacer pattern as a mask, the hard mask layer and the process object are processed.

Abstract: According to one embodiment, first, a core pattern is formed above a hard mask layer that is formed above a process object. Then, a spacer film is formed above the hard mask layer. Next, the spacer film is etch-backed. Subsequently, an embedded layer is embedded between the core patterns whose peripheral areas are surrounded by the spacer film. Then, the core pattern and the embedded layer are removed simultaneously. Subsequently, using the spacer pattern as a mask, the hard mask layer and the process object are processed.

Abstract: There is disclosed a method of designing a pattern comprising: preparing a first design pattern containing a first hole pattern, obtaining a distance between the first hole pattern and a pattern adjacent to the first hole pattern, obtaining an enlarged amount of the first hole pattern based on the distance and a reduction amount of a hole pattern formed in a photoresist film when the photoresist film is heated, and generating a second design pattern containing a second hole pattern which are obtained by enlarging the first hole pattern by the enlarged amount.

Abstract: There is disclosed a method of designing a pattern comprising: preparing a first design pattern containing a first hole pattern, obtaining a distance between the first hole pattern and a pattern adjacent to the first hole pattern, obtaining an enlarged amount of the first hole pattern based on the distance and a reduction amount of a hole pattern formed in a photoresist film when the photoresist film is heated, and generating a second design pattern containing a second hole pattern which are obtained by enlarging the first hole pattern by the enlarged amount.