Patents by Inventor Maki Nakamura
Maki Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117231Abstract: The pressure-sensitive adhesive layer forming organopolysiloxane composition of this disclosure is hydrosilylation reaction curable, wherein 1 mass % or more of a resin component is (b2) an organopolysiloxane resin having a weight average molecular weight (Mw) as measured in terms of standard polystyrene by GPC using toluene that is less than 4000, and the value obtained by dividing Tg+120(° C.) of the pressure-sensitive adhesive layer obtained by curing by Tg?+120(° C.) of the composition (pressure-sensitive adhesive layer), in which component (b2) is substituted by a resin with Mw 4000 or higher is less than 1.0. When used as a pressure-sensitive adhesive layer and when a specific resin component/polymer component ratio is selected to achieve a pressure-sensitive adhesive strength, the glass transition temperature (Tg) of the pressure-sensitive adhesive layer can be further reduced, resulting in a strong pressure-sensitive adhesive force and a low Tg at the same time.Type: ApplicationFiled: December 24, 2021Publication date: April 11, 2024Inventors: Maki ITOH, Akihiro NAKAMURA, Michitaka SUTO
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Publication number: 20240090309Abstract: A semiconductor material of the present disclosure is represented by formula (I) below, in which R1, R2, and R3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, R4 represents an aryl group, an amino group, a hydroxy group, or an alkoxy group, and n represents an integer greater than or equal to 2; and a photoelectric conversion element of the present disclosure includes a first electrode, a photoelectric conversion layer, a hole transport layer, and a second electrode in this order, in which the hole transport layer includes the semiconductor material of the present disclosure:Type: ApplicationFiled: November 9, 2023Publication date: March 14, 2024Inventors: TORU NAKAMURA, MAKI HIRAOKA, HIROSHI HIGUCHI
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Publication number: 20230223696Abstract: A planar antenna device includes: a dielectric; an antenna layer provided on one main surface of the dielectric; and a ground layer provided on an other main surface of the dielectric to oppose the antenna layer. The planar antenna device generates an electric field in a first direction along the other main surface by radiating radio waves with linear polarization from the antenna layer. The ground layer includes a grid-like ground electrode portion and a plurality of openings positioned in regions other than the ground electrode portion, each of the plurality of openings being quadrilateral in shape. Each of the plurality of openings includes two first opening sides parallel to the first direction and two second opening sides perpendicular to the first direction. A length of each of the first opening sides is longer than a length of each of the second opening sides.Type: ApplicationFiled: March 8, 2023Publication date: July 13, 2023Inventor: Maki NAKAMURA
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Patent number: 10965020Abstract: In an antenna device, an isolation structure between antenna elements includes: a conductor on a surface of a dielectric substrate; and a plurality of via conductors that penetrate the dielectric substrate and electrically connect the conductor to the ground conductor. A value of (d1×2+h1)/(?1/??r) falls within a range from 0.40 to 0.60, where the dielectric substrate has a dielectric constant ?r, a signal transmitted from the antenna element has a wavelength ?1 (mm), each via conductor has a height h1 (mm), and the conductor protrudes with a length d1 (mm) toward the antenna element.Type: GrantFiled: November 25, 2019Date of Patent: March 30, 2021Assignee: SOCIONEXT INC.Inventor: Maki Nakamura
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Publication number: 20200091599Abstract: In an antenna device, an isolation structure between antenna elements includes: a conductor on a surface of a dielectric substrate; and a plurality of via conductors that penetrate the dielectric substrate and electrically connect the conductor to the ground conductor. A value of (d1×2+h1)/(?1/??r) falls within a range from 0.40 to 0.60, where the dielectric substrate has a dielectric constant ?r, a signal transmitted from the antenna element has a wavelength ?1 (mm), each via conductor has a height h1 (mm), and the conductor protrudes with a length d1 (mm) toward the antenna element.Type: ApplicationFiled: November 25, 2019Publication date: March 19, 2020Inventor: Maki NAKAMURA
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Patent number: 10117327Abstract: A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.Type: GrantFiled: February 5, 2016Date of Patent: October 30, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Ryosuke Shiozaki, Maki Nakamura, Junji Sato
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Patent number: 9711861Abstract: An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.Type: GrantFiled: May 27, 2015Date of Patent: July 18, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Yuichi Kashino, Hiroyuki Uno, Maki Nakamura, Suguru Fujita
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Patent number: 9711862Abstract: A wireless device includes an antenna that has a planar shape and radiates a radio signal toward another wireless device, and a chassis housing the antenna and having an outer peripheral portion placed to face the antenna. Multiple distances between a surface of the outer peripheral portion and the antenna are non-uniform.Type: GrantFiled: May 27, 2015Date of Patent: July 18, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Suguru Fujita, Maki Nakamura
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Patent number: 9666952Abstract: An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.Type: GrantFiled: May 1, 2015Date of Patent: May 30, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Suguru Fujita, Yuichi Kashino, Maki Nakamura, Kentaro Watanabe
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Patent number: 9601818Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members.Type: GrantFiled: June 3, 2014Date of Patent: March 21, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Suguru Fujita, Maki Nakamura
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Patent number: 9437535Abstract: Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.Type: GrantFiled: January 29, 2014Date of Patent: September 6, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Maki Nakamura, Suguru Fujita
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Publication number: 20160249448Abstract: A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.Type: ApplicationFiled: February 5, 2016Publication date: August 25, 2016Inventors: RYOSUKE SHIOZAKI, MAKI NAKAMURA, JUNJI SATO
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Patent number: 9293419Abstract: A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.Type: GrantFiled: April 6, 2015Date of Patent: March 22, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Maki Nakamura, Suguru Fujita
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Publication number: 20150357701Abstract: A wireless device includes an antenna that has a planar shape and radiates a radio signal toward another wireless device, and a chassis housing the antenna and having an outer peripheral portion placed to face the antenna. Multiple distances between a surface of the outer peripheral portion and the antenna are non-uniform.Type: ApplicationFiled: May 27, 2015Publication date: December 10, 2015Inventors: SUGURU FUJITA, MAKI NAKAMURA
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Publication number: 20150349428Abstract: An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.Type: ApplicationFiled: May 27, 2015Publication date: December 3, 2015Inventors: YUICHI KASHINO, HIROYUKI UNO, MAKI NAKAMURA, SUGURU FUJITA
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Publication number: 20150332997Abstract: Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.Type: ApplicationFiled: January 29, 2014Publication date: November 19, 2015Inventors: Maki Nakamura, Suguru Fujita
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Publication number: 20150325922Abstract: An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.Type: ApplicationFiled: May 1, 2015Publication date: November 12, 2015Inventors: SUGURU FUJITA, YUICHI KASHINO, MAKI NAKAMURA, KENTARO WATANABE
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Publication number: 20150303146Abstract: A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.Type: ApplicationFiled: April 6, 2015Publication date: October 22, 2015Inventors: MAKI NAKAMURA, SUGURU FUJITA
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Publication number: 20150288390Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.Type: ApplicationFiled: March 23, 2015Publication date: October 8, 2015Inventors: MAKI NAKAMURA, SUGURU FUJITA
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Publication number: 20150207197Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members.Type: ApplicationFiled: June 3, 2014Publication date: July 23, 2015Inventors: Suguru Fujita, Maki Nakamura