Patents by Inventor Makiko Ueda

Makiko Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vibration damping material of polyamides and mercaptobenzoimidazoles
    Publication number: 20080026246
    Abstract: The polyamide resin composition of the present invention is useful as a sound dampening material and includes (1) 30-97 wt % polyamide selected from (a) crystalline polyamide, (b) amorphous polyamide, or a mixture of (a) and (b), and (2) 1-30 wt % of a mercaptobenzoimidazole The polyamide resin composition of the present invention can further include a plasticizer or an inorganic filler.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 31, 2008
    Inventors: Yuji Saga, Makiko Ueda, Yasuyuki Ohira, Tatsuya Aoki
  • Process for laser welding
    Publication number: 20070131348
    Abstract: A process for laser welding objects comprising the thermoplastic polymer compositions comprising a material having voids.
    Type: Application
    Filed: October 16, 2006
    Publication date: June 14, 2007
    Inventors: Katsuhiko Nakajima, Hideo Nakamura, Toshio Watanabe, Hiroshi Mori, Mitsunobu Nakatani, Makiko Ueda