Patents by Inventor Makio Onodera

Makio Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glass substrate and glass cutting method
    Patent number: 7479319
    Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: January 20, 2009
    Assignee: Sony Corporation
    Inventors: Tomio Hirano, Nobuyuki Oikawa, Makio Onodera, Masao Ono, Hideki Sato, Yukihiro Onodera
  • Glass substrate and glass cutting method
    Publication number: 20040086688
    Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.
    Type: Application
    Filed: July 18, 2003
    Publication date: May 6, 2004
    Applicant: Sony Corporation
    Inventors: Tomio Hirano, Nobuyuki Oikawa, Makio Onodera, Masao Ono, Hideki Sato, Yukihiro Onodera