Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Abstract: A liquid crystal display apparatus according to the present embodiment has pixel electrodes arranged in a first and a second directions crossed each other; a signal line formed in a lower layer of the pixel electrode and extending in the second direction between the pixel electrodes arranged in the first direction; a scan line formed in a lower layer of the pixel electrode and extending in the first direction; a switching device formed so as to correspond to the pixel electrodes and connected to the signal line, the scan line, and the pixel electrode; and an insulating layer formed between the pixel electrode and a lower layer including the signal line and the scan line, and having a surface step in a region between the pixel electrodes. An edge portion of the pixel electrode is formed to overlap the surface step of the insulating layer.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Abstract: A liquid crystal panel has a liquid crystal layer of liquid crystal molecules sealed between a pair of substrates having alignment films thereon. Each of the films includes first and second deposited layers, each of the layers being formed of an inorganic material by oblique deposition. The second layer is stacked on top of the first layer such that the deposited molecules of the first layer are aligned substantially perpendicular to the orientation of the deposited molecules of the second layer. The first layer is formed by oblique deposition at an oblique angle of about 60° relative to the normal of the substrate surface to align the liquid crystal molecules perpendicular to the deposited molecules. The second layer is formed by oblique deposition at an oblique angle of about 85° relative to the normal of the substrate surface to align the liquid crystal molecules parallel to the deposited molecules.

Abstract: A liquid crystal panel has a liquid crystal layer of liquid crystal molecules sealed between a pair of substrates having alignment films thereon. Each of the films includes first and second deposited layers, each of the layers being formed of an inorganic material by oblique deposition. The second layer is stacked on top of the first layer such that the deposited molecules of the first layer are aligned substantially perpendicular to the orientation of the deposited molecules of the second layer. The first layer is formed by oblique deposition at an oblique angle of about 60° relative to the normal of the substrate surface to align the liquid crystal molecules perpendicular to the deposited molecules. The second layer is formed by oblique deposition at an oblique angle of about 85° relative to the normal of the substrate surface to align the liquid crystal molecules parallel to the deposited molecules.

Abstract: A polishing surface constituting member capable of polishing an object surface flat and uniformly with minimal overpolishing at the edge of the object is provided, together with a polishing apparatus using the polishing surface constituting member. The polishing surface constituting member polishes the object pressed against it under a predetermined pressure by relative movement therebetween. A surface of the polishing surface constituting member that comes in contact with the object is provided with grooves at a predetermined pitch or provided with projections in a predetermined configuration.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece to be polished, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece to be polished is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with a surface of a polishing cloth.

Abstract: A substrate polishing apparatus wherein semiconductor substrate is held by a top ring 10-2 or 11-2 and is pressed against a polishing surface of a polishing table 10-1 or 10-2. A surface to be polished of the semiconductor substrate is polished by a relative movement between the semiconductor substrate and the polishing surface. The apparatus includes pressing force changing mechanism for changing an pressing force for pressing the semiconductor substrate, relative movement seed changing mechanism for changing the number of revolutions of the top ring and/or the polishing table, and control mechanism. The control mechanism performs the polishing through plural polishing processes on the polishing table 10-1 or 10-2 while changing the pressing force and the number of revolutions.