Patents by Inventor Makoto Ebina

Makoto Ebina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead pin for mounting semiconductor and printed wiring board
    Patent number: 8426748
    Abstract: A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: April 23, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Masanori Kawade, Hiroyuki Tsuruga, Makoto Ebina
  • LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD
    Publication number: 20100187004
    Abstract: A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.
    Type: Application
    Filed: March 17, 2010
    Publication date: July 29, 2010
    Applicants: IBIDEN CO., LTD., TIBC CO. LTD.
    Inventors: Masanori KAWADE, Hiroyuki Tsuruga, Makoto Ebina
  • Lead pin for mounting semiconductor and printed wiring board
    Patent number: 7723620
    Abstract: A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: May 25, 2010
    Assignees: IBIDEN Co., Ltd., TIBC Co., Ltd.
    Inventors: Masanori Kawade, Hiroyuki Tsuruga, Makoto Ebina
  • Lead Pin for Mounting Semiconductor and Printed Wiring Board
    Publication number: 20080055874
    Abstract: A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
    Type: Application
    Filed: August 30, 2005
    Publication date: March 6, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Masanori Kawade, Hiroyuki Tsuruga, Makoto Ebina