Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Abstract: Provided are an ultrasonic probe and an ultrasonic diagnostic apparatus, which reduce parastic impedances which occurs in upper electrodes and lower electrodes, thereby reducing cross talk. The ultrasonic probe comprises a cMUT chip (20) having a plurality of transducer elements, an acoustic lens (26) on the ultrasonic wave irradiation side of the cMUT chip (20), a backing layer (22) on the back of the cMUT chip (20), and wires connected with the cMUT chip (20). This cMUT chip (20) includes a plurality of upper electrodes (46) and a plurality of lower electrodes (48), and these lower electrodes (48) are connected at two or more portions with wires.

Abstract: An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.

Abstract: An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.

Abstract: Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT (20) having vibratory elements that change the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied; a backing layer (22) adhered to the rear side of the ultrasonic transmission surface of the CMUT (20); and a thermal-stress balancing member (24) to be adhered to the backing layer (22) while being disposed facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween so as to minimize the warpage of the CMUT (20) due to thermal stress produced between the CMUT (20).

Abstract: An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.

Abstract: An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.

Abstract: Provided are an ultrasonic probe and an ultrasonic diagnostic apparatus, which reduce parastic impedances which occurs in upper electrodes and lower electrodes, thereby reducing cross talk. The ultrasonic probe comprises a cMUT chip (20) having a plurality of transducer elements, an acoustic lens (26) on the ultrasonic wave irradiation side of the cMUT chip (20), a backing layer (22) on the back of the cMUT chip (20), and wires connected with the cMUT chip (20). This cMUT chip (20) includes a plurality of upper electrodes (46) and a plurality of lower electrodes (48), and these lower electrodes (48) are connected at two or more portions with wires.

Abstract: An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.