Abstract: An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.

Abstract: A manufacturing speed for a laminated member for every layer is increased to improve productivity and at the same time a small-sized manufacturing apparatus capable of being practically realized is provided. A base plate is mounted at a linear predetermined segment path in such a way that it can be reciprocated and moved up and down, each of one to a plurality of an insulating layer forming means for discharging ceramics slurry or insulating resin paste, conductive layer forming means for injecting conductive paste by an ink jet system and drying means for drying said slurry, paste are arranged side by side on the segment path, the thin film layer having a predetermined electrode pattern arranged thereon is formed on the ceramics insulating layer while the base plate reciprocates by once to several times over the segment path, and these operations are repeated to form the laminated member.

Abstract: An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.

Abstract: A manufacturing speed for a laminated member for every layer is increased to improve productivity and at the same time a small-sized manufacturing apparatus capable of being practically realized is provided. A base plate is mounted at a linear predetermined segment path in such a way that it can be reciprocated and moved up and down, each of one to a plurality of an insulating layer forming means for discharging ceramics slurry or insulating resin paste, conductive layer forming means for injecting conductive paste by an ink jet system and drying means for drying said slurry, paste are arranged side by side on the segment path, the thin film layer having a predetermined electrode pattern arranged thereon is formed on the ceramics insulating layer while the base plate reciprocates by once to several times over the segment path, and these operations are repeated to form the laminated member.