Patents by Inventor Makoto Furutani

Makoto Furutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143107
    Abstract: A display device with a touch sensor having a display function and a touch sensor function is provided. The display device includes a first substrate including a pixel electrode; a first electrode along a first direction; and a second substrate including a second electrode that includes patterns of electrodes along a second direction crossing the first direction and that faces the first electrode and the pixel electrode, wherein upon the display function being activated, the pixel electrode is supplied with a pixel signal, and the second electrode is supplied with common voltage, and upon the touch sensor function being activated, the first electrode is applied with a first signal and the second electrode is configured to receive the first signal to be a second signal as a touch detecting signal.
    Type: Application
    Filed: December 8, 2023
    Publication date: May 2, 2024
    Inventors: Naosuke FURUTANI, Hayato KURASAWA, Makoto HAYASHI
  • Patent number: 7858168
    Abstract: There is disclosed a honeycomb structure in which while sufficiently maintaining a collection efficiency and a bonding strength of a plugging portion, a thermal shock resistance is improved. A plugging portion 32 is formed in the end of each cell 3 of a honeycomb structure 1, and a gap 34 having a size of 20 ?m or more is formed between the plugging portion 32 and each partition wall 2. Moreover, the length of the gap 34 in the axial direction is 50% or more and less than 95% of the length of the plugging portion 32 in the axial direction, the length of the gap in a face vertical to the axial direction is 20% or more and 50% or less of the length of the inner peripheral surface of the cell 3, and the gaps are formed in at least ? of the plugging portions 32.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: December 28, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Toshio Yamada, Takeshi Tokunaga, Makoto Furutani
  • Publication number: 20090246458
    Abstract: There is disclosed a honeycomb structure in which while sufficiently maintaining a collection efficiency and a bonding strength of a plugging portion, a thermal shock resistance is improved. A plugging portion 32 is formed in the end of each cell 3 of a honeycomb structure 1, and a gap 34 having a size of 20 ?m or more is formed between the plugging portion 32 and each partition wall 2. Moreover, the length of the gap 34 in the axial direction is 50% or more and less than 95% of the length of the plugging portion 32 in the axial direction, the length of the gap in a face vertical to the axial direction is 20% or more and 50% or less of the length of the inner peripheral surface of the cell 3, and the gaps are formed in at least ? of the plugging portions 32.
    Type: Application
    Filed: March 25, 2009
    Publication date: October 1, 2009
    Applicant: NGK Insulators, Ltd.
    Inventors: Toshio YAMADA, Takeshi TOKUNAGA, Makoto FURUTANI
  • Patent number: 6723448
    Abstract: A method of manufacturing a honeycomb extrusion die has the steps of: preparing a die base metal in which a plurality of intersecting slits are arranged in a front surface thereof and a plurality of raw material feeding holes communicated with the slits are arranged in a back surface thereof; forming a plating layer on the die base metal by means of electrolytic plating; (1) and forming a TiCN layer on the plating layer by means of CVD (chemical vapor deposition); or (2) forming a TiN layer on the plating layer by means of CVD (chemical vapor deposition); and forming a TiCN layer on the TiN layer by means of CVD. In this manner, the honeycomb extrusion die is obtained.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: April 20, 2004
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuji Asai, Makoto Furutani, Keiji Matsumoto
  • Publication number: 20020152603
    Abstract: A method of manufacturing a honeycomb extrusion die has the steps of: preparing a die base metal in which a plurality of intersecting slits are arranged in a front surface thereof and a plurality of raw material feeding holes communicated with the slits are arranged in a back surface thereof; forming a plating layer on the die base metal by means of electrolytic plating; (1) and forming a TiCN layer on the plating layer by means of CVD (chemical vapor deposition); or (2) forming a TiN layer on the plating layer by means of CVD (chemical vapor deposition); and forming a TiCN layer on the TiN layer by means of CVD. In this manner, the honeycomb extrusion die is obtained.
    Type: Application
    Filed: January 29, 2002
    Publication date: October 24, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Yuji Asai, Makoto Furutani, Keiji Matsumoto