Abstract: There is provided a photo-curable composition that shows the suppression of a residual film formation and a high adhesion thereof to a substrate in a process for forming a three-dimensional pattern by a photo-imprinting method. A photo-curable composition for forming a three-dimensional pattern by a photo-imprinting method, comprises a monomer having a photopolymerizable group; an inorganic fine particle to which a dispersant is added; and a photopolymerization initiator. It is preferred that the inorganic fine particle (e.g., silica) has an average particle diameter of 1 to 1,000 nm, and the dispersant is a silane coupling agent, particularly a silane coupling agent containing an organic group having a carbon-carbon unsaturated bond or an organic group having an epoxy group.

Abstract: There is provided a photo-curable composition that shows the suppression of a residual film formation and a high adhesion thereof to a substrate in a process for forming a three-dimensional pattern by a photo-imprinting method. A photo-curable composition for forming a three-dimensional pattern by a photo-imprinting method, comprises a monomer having a photopolymerizable group; an inorganic fine particle to which a dispersant is added; and a photopolymerization initiator. It is preferred that the inorganic fine particle (e.g., silica) has an average particle diameter of 1 to 1,000 nm, and the dispersant is a silane coupling agent, particularly a silane coupling agent containing an organic group having a carbon-carbon unsaturated bond or an organic group having an epoxy group.

Abstract: A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1): A-[(J)m-(X-Pro)]n??(1) wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1. The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.

Abstract: A photosensitive resin composition for using in combination with a photosensitizer comprises an active component selected from an active metal alkoxide represented by the formula (1) or a polycondensate thereof and a particle represented by the formula (2), (X)m-n-Mm-[(U1)p—(U2-Z)t]n??(1) P—[(Y)s—{(U1)p—(U2-Z)t}]k??(2) wherein, X shows a hydrogen, a halogen, an alkoxy group or an alkoxycarbonyl group, M shows a metal atom whose valence m is not less than 2, U1 shows a first connecting unit, U2 shows a second connecting unit and Z shows a group causing a difference in solubility by light exposure, P shows a fine particle carrier, Y shows a coupling residue, n shows an integer of not less than 1 and m>n, p shows 0 or 1, t shows 1 or 2, k shows an integer of not less than 1, and s shows 0 or 1).

Abstract: Active particles which when incorporated into a photosensitive composition containing base resin and diazonium-series photosensitizer provide improvement in at least one or both of sensitivity and resolutionn. The active particles include a particulate carrier, such as silica sol, and an aromatic unit directly or indirectly bonded to the carrier. The aromatic unit has a phenolic hydroxyl group and no substituent in at least one of the o- and p-positions, in relation to the phenolic hydroxyl group. The active particles, when incorporated into the photosensitive composition can, after exposure, increase solubility difference between the exposed and non-exposed areas.

Abstract: A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1):

Abstract: A photosensitive resin composition for using in combination with a photosensitizer comprises an active component selected from an active metal alkoxide represented by the formula (1) or a polycondensate thereof and a particle represented by the formula (2),

Abstract: photosensitive resin composition of the present invention is prepared by adding inorganic particles having a functional group and a mean particle size smaller than the wavelength of light for exposure (e.g., about 1 to 100 nm) to a photosensitive resin. The inorganic particles can be of colloidal silica having a functional group. The photosensitive resin composition may be of positive or negative type, and developable with water or an alkali. The amount of the inorganic particles to be used is, relative to 100 parts by weight of the photosensitive resin, about 10 to 500 parts by weight on a solid matter basis. The use of such photosensitive resin composition makes it possible to largely improve oxygen plasma resistance, heat resistance, dry etching resistance, sensitivity, and resolution utilizing a conventional resist or lithography technique.

Abstract: The present invention provides a piezoelectric thin film element comprising a piezoelectric thin film having a uniform specific shape, a process for producing the same, and an ink jet recording head using the piezoelectric thin film element. A piezoelectric thin film element (1) comprises a substrate (5), a lower electrode (2), a piezoelectric thin film (3) and an upper electrode (4) in this order. A vertical cross-sectional shape and/or a vertical longitudinal sectional shape of the piezoelectric thin film (3) with respect to the substrate (5) is a quadrilateral having upper and lower sides mutually facing and substantially parallel to each other and both lateral sides. A length Lu of the upper side and a length Lb of the lower side preferably satisfy the relationship of Lu>Lb. Angles &thgr;l and &thgr;r defined between the lower side and the respective lateral sides are expressed as follows: 90°<&thgr;l<150° and 90°<&thgr;r<150°.

Abstract: An inorganic pattern is formed by coating an inorganic substance-containing photosensitive composition comprising a photosensitive polymer (A), a condensable organic metal compound or a condensate thereof (B) and an inorganic filler having a functional group (C) on a base, exposing the coated layer, and developing the exposed layer to form a pattern, baking the pattern give an inorganic pattern. The photosensitive polymer (A) may be constituted of an oligomer or polymer, and a photosensitizer, and the condensable organic metal compound (B) may have a photosensitive group. The inorganic filler may be a monodispersed colloidal silica having a mean particle size of 2 to 100 nm. The proportions of the components (B) and (C) relative to 1 part by weight of the component (A) on a solid basis are about 1 to 25 parts by weight and about 1 to 20 parts by weight, respectively.

Abstract: A positive resist composition which comprises a 1,2-quinone diazide compound and an alkali-soluble resin containing a polyphenol compound (I) of the general formula:X--.alpha.--H (I)wherein x is a group of the formula: ##STR1## and .alpha. is a divalent group which comprises a repeating unit of the formula: ##STR2## in which n is a number of not less than 1; a, b, c, d, e and f are the same or different and a number of 0-3, provided that d+f is not less than 1; R.sub.1, R.sub.2 and R.sub.3 are the same or different and a C.sub.1 -C.sub.18 alkyl group, a C.sub.1 -C.sub.18 alkoxy group, a carboxyl group or a halogen atom; R.sub.4 is a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or an aryl group, which resist composition is sensitive to radiation and has good balance of sensitivity, resolving power and heat resistance.

Abstract: A positive resist composition which comprises, in admixture, a photosensitive 1,2-quinone diazide compound, an alkali-soluble resin to bind ingredients and polyphenol compound to control a dissolution rate in a developer having a molecular weight of not more than 550 and represented by the general formula: ##STR1## wherein a, b, c, d, e, and f are the same or different and a number of 0-3, provided that d+f is not less than 1, and provided that if b, d and f are 1, then at least one of a, c, and e is not 0; R.sub.1, R.sub.2 and R.sub.3 are the same or different and a C.sub.1 -C.sub.18 alkyl group, a C.sub.1 -C.sub.18 alkoxy group, a carboxyl group or a halogen atom; R.sub.4 is a hydrogen atom, a C.sub.1 -C.sub.

Abstract: A positive resist composition which comprises, in admixture, a photosensitive 1,2-quinone diazide compound, an alkali-soluble resin to bind ingredients and polyphenol compound to control a dissolution rate in a developer represented by the formula: ##STR1## wherein R is C.sub.1-18 or hydrogen, the composition is sensitive to radiation and has good balance of sensitivity, resolving power and heat resistance.

Abstract: A positive resist composition which comprises in admixture an alkali-soluble resin and, as a sensitizer, first and second quinone diazide sulfonic acid esters of a phenol compound, wherein(a) the first ester is a quinone diazide sulfonic acid diester of a phenol compound having not less than three hydroxyl groups which exhibits a pattern area that is not less than 40% of all pattern areas corresponding to the sensitizer in a high pressure liquid chromatography (HPLC) pattern measured with a primary detector using UV light having a wavelength of 254 nm, and(b) the second ester is a quinone diazide sulfonic acid ester that is a complete ester of a phenol compound having not less than two hydroxyl groups which exhibits a pattern area corresponding to not less than 5% and is less than 60% of all pattern areas corresponding to the sensitizer in the HPLC pattern.

Abstract: A quinone diazide sulfonic acid ester of a phenol compound of the general formula (I): ##STR1## wherein Y.sub.1, Y.sub.2, Y.sub.3 and Y.sub.4 are the same or different and each a hydrogen atom, an alkyl group, a halogen atom or a hydroxyl group, provided that at least one of Y.sub.1, Y.sub.2, Y.sub.3 and Y.sub.4 is a hydroxyl group; Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5 and Z.sub.6 are the same or different and each a hydrogen atom, an alkyl, an aryl group, a halogen atom or a hydroxyl group, provided that at least one of Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5 and Z.sub.6 is a hydroxyl group; X is ##STR2## in which R.sub.1 and R.sub.2 are the same or different and each a hydrogen atom, an alkyl group, an alkenyl group, a cyclo-alkyl group, an alkoxy group or an aryl group, provided that when at least one of R.sub.1 and R.sub.

Abstract: A quinone diazide sulfonic acid ester of a phenol compound of the general formula (I) or (II): ##STR1## wherein a, c and d are the same or different and a number of 0 to 3, provided that when a is 0 or 3, b is a number of 0 to 3 or when a is 1 or 2, b is 0, 1 or 2, and a+b and c+d are not less than 2; R and R' are the same or different and an alkyl group or an aryl group provides a positive resist composition having a high .gamma.-value.

Abstract: A quinone diazide sulfonic acid ester of a phenol compound of the general formula (I): ##STR1## wherein Y.sub.1 and Y.sub.2 are each a hydrogen atom, an alkyl group or a hydroxyl group, provided that at least one of Y.sub.1 and Y.sub.2 is a hydroxyl group; Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5, Z.sub.6 and Z.sub.7 are the same or different and each a hydrogen atom, a hydroxyl group, an alkyl group, a cycloalkyl group, an aryl group or halogen atom, provided that at least two of Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5, Z.sub.6 and Z.sub.7 are hydroxyl groups; R.sub.1, R.sub.2 and R.sub.3 are the same or different and each a hydrogen atom, an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group provides a positive resist composition having a high .gamma.-value.

Abstract: A positive type photoresist composition comprising a novolak resin and O-quinone diazide compound, the novolak resin being one which is obtained by the addition condensation reaction of a phenol and formaldehyde which is performed in one stage by using as a catalyst an organic acid salt of a divalent metal which is more electropositive than hydrogen, or in two stages by using an acid catalyst in the subsequent stage, the phenol being at least one compound represented by the formula ##STR1## wherein R is hydrogen or an alkyl group of carbon number 1 to 4, the compound being such that the average carbon number in the substituent per one phenol nucelus is 0.5 to 1.5 and the ones with the substituent at the ortho- or para-position with respect to the hydroxyl group account for less than 50 mol %, is disclosed. The positive type photoresist composition of the invention has an improved resolving power, i.e., .gamma.-value.

Abstract: A novolak resin for a positive photoresist is provided herein, which resin is produced by the addition condensation reaction of a phenol with formaldehyde. This novolak resin has improved heat resistant and sensitivity properties and the thickness retention of the novolak resins are very high.

Abstract: A positive type photoresist composition comprising an m-hydroxy-.alpha.-methylstyrene polymer and as a photo-sensitizer a quinonediazide compound is disclosed. A positive type photoresist composition comprising an m-hydroxy-.alpha.-methylstyrene polymer, a novolak resin, and as a photo-sensitizer a quinonediazide compound, is also disclosed.