Patents by Inventor Makoto Haseyama
Makoto Haseyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8759119Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.Type: GrantFiled: February 26, 2013Date of Patent: June 24, 2014Assignee: Fujitsu Semiconductor LimitedInventors: Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama, Kenichi Nagashige, Yoshiyuki Yoneda, Hirohisa Matsuki
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Patent number: 8404496Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.Type: GrantFiled: May 24, 2006Date of Patent: March 26, 2013Assignee: Fujitsu Semiconductor LimitedInventors: Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama, Kenichi Nagashige, Yoshiyuki Yoneda, Hirohisa Matsuki
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Patent number: 7304487Abstract: A contactor apparatus having a first contactor (2) and a second contactor (4) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer (6). The first contactor (2) has contacts (2b) which are directly brought into contact with power supply terminals (6a) of the semiconductor devices. The second contactor (4) is movable relative to the first contactor (2) and has contacts (4a) which are brought into contact with signal terminals (6b) of the semiconductor devices. Thereby, the number of contacts to be formed on a single contactor can be reduced and the number of pattern wirings can also be reduced, which makes the fabrication of the contactor easier.Type: GrantFiled: October 12, 2005Date of Patent: December 4, 2007Assignee: Fujitsu LimitedInventor: Makoto Haseyama
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Patent number: 7196530Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.Type: GrantFiled: September 26, 2003Date of Patent: March 27, 2007Assignee: Fujitsu LimitedInventors: Makoto Haseyama, Shigeyuki Maruyama
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Patent number: 7174629Abstract: An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.Type: GrantFiled: February 21, 2003Date of Patent: February 13, 2007Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Makoto Haseyama, Futoshi Fukaya, Susumu Moriya, Naomi Miyaji
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Patent number: 7161370Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.Type: GrantFiled: February 1, 2005Date of Patent: January 9, 2007Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Kazuhiro Tashiro, Makoto Haseyama
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Publication number: 20060279003Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.Type: ApplicationFiled: May 24, 2006Publication date: December 14, 2006Applicant: FUJITSU LIMITEDInventors: Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama, Kenichi Nagashige, Yoshiyuki Yoneda, Hirohisa Matsuki
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Patent number: 7112889Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.Type: GrantFiled: May 25, 2000Date of Patent: September 26, 2006Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama, Kenichi Nagashige, Yoshiyuki Yoneda, Hirohisa Matsuki
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Patent number: 7028398Abstract: A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.Type: GrantFiled: July 30, 2003Date of Patent: April 18, 2006Assignee: Fujitsu LimitedInventors: Makoto Haseyama, Shigeyuki Maruyama
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Publication number: 20060028223Abstract: A contactor apparatus having a first contactor (2) and a second contactor (4) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer (6). The first contactor (2) has contacts (2b) which are directly brought into contact with power supply terminals (6a) of the semiconductor devices. The second contactor (4) is movable relative to the first contactor (2) and has contacts (4a) which are brought into contact with signal terminals (6b) of the semiconductor devices. Thereby, the number of contacts to be formed on a single contactor can be reduced and the number of pattern wirings can also be reduced, which makes the fabrication of the contactor easier.Type: ApplicationFiled: October 12, 2005Publication date: February 9, 2006Inventor: Makoto Haseyama
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Patent number: 6975126Abstract: A contactor apparatus having a first contactor (2) and a second contactor (4) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer (6). The first contactor (2) has contacts (2b) which are directly brought into contact with power supply terminals (6a) of the semiconductor devices. The second contactor (4) is movable relative to the first contactor (2) and has contacts (4a) which are brought into contact with signal terminals (6b) of the semiconductor devices. Thereby, the number of contacts to be formed on a single contactor can be reduced and the number of pattern wirings can also be reduced, which makes the fabrication of the contactor easier.Type: GrantFiled: October 3, 2003Date of Patent: December 13, 2005Assignee: Fujitsu LimitedInventor: Makoto Haseyama
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Publication number: 20050162180Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.Type: ApplicationFiled: February 1, 2005Publication date: July 28, 2005Applicant: FIJITSU LIMITEDInventors: Shigeyuki Maruyama, Kazuhiro Tashiro, Makoto Haseyama, Futoshi Fukaya
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Patent number: 6882169Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.Type: GrantFiled: October 16, 2003Date of Patent: April 19, 2005Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Kazuhiro Tashiro, Makoto Haseyama
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Patent number: 6781395Abstract: A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.Type: GrantFiled: May 23, 2003Date of Patent: August 24, 2004Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Futoshi Fukaya, Makoto Haseyama
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Publication number: 20040124866Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.Type: ApplicationFiled: October 16, 2003Publication date: July 1, 2004Applicant: FUJITSU LIMITEDInventors: Shigeyuki Maruyama, Kazuhiro Tashiro, Makoto Haseyama, Futoshi Fukaya
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Publication number: 20040070010Abstract: A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.Type: ApplicationFiled: July 30, 2003Publication date: April 15, 2004Applicant: FUJITSU LIMITEDInventors: Makoto Haseyama, Shigeyuki Maruyama
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Publication number: 20040070961Abstract: A contactor apparatus having a first contactor (2) and a second contactor (4) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer (6). The first contactor (2) has contacts (2b) which are directly brought into contact with power supply terminals (6a) of the semiconductor devices. The second contactor (4) is movable relative to the first contactor (2) and has contacts (4a) which are brought into contact with signal terminals (6b) of the semiconductor devices. Thereby, the number of contacts to be formed on a single contactor can be reduced and the number of pattern wirings can also be reduced, which makes the fabrication of the contactor easier.Type: ApplicationFiled: October 3, 2003Publication date: April 15, 2004Applicant: FUJITSU LIMITEDInventor: Makoto Haseyama
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Publication number: 20040070412Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.Type: ApplicationFiled: September 26, 2003Publication date: April 15, 2004Applicant: FUJITSU LIMITEDInventors: Makoto Haseyama, Shigeyuki Maruyama
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Patent number: 6661247Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.Type: GrantFiled: April 9, 2001Date of Patent: December 9, 2003Assignee: Fujitsu LimitedInventors: Shigeyuki Maruyama, Kazuhiro Tashiro, Makoto Haseyama, Futoshi Fukaya
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Patent number: 6643922Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.Type: GrantFiled: December 3, 2002Date of Patent: November 11, 2003Assignee: Fujitsu LimitedInventors: Makoto Haseyama, Shigeyuki Maruyama