Abstract: A method of producing an inorganic solid pattern is described that includes: a step of coating an inorganic solid with a composition containing a polymetalloxane and an organic solvent; a step of heating the coating film obtained in the coating step, at a temperature of 100° C. or more and 1000° C. or less to form a heat-treated film; a step of forming a pattern of the heat-treated film; and a step of patterning the inorganic solid by etching using the pattern of the heat-treated film as a mask.

Abstract: An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (Rb/Ra) between an alkali dissolution rate (Ra) of the resin (a) and an alkali dissolution rate (Rb) of the resin (b) satisfies a relationship of 0.5?Rb/Ra?2.0.

Abstract: A glass-ceramic obtained by heat treating a parent glass in which specific amounts of MgO and PbO are added to the SiO.sub.2 - Al.sub.2 O.sub.3 - ZnO - TiO.sub.2 system glass has a wide range of coefficients of thermal expansion and improved fineness in diameters of crystals and also improved chemical durability or thermal expansion curve.