Abstract: A display system includes: a first display device displaying an image in a first region to cause the image to be visually recognized in a position at a first distance from a visual line of a driver of an auto-vehicle; a second display device displaying an image in a second region to cause the image to be visually recognized at a second distance greater than the first distance from the visual line; and a display controller displaying a warning image in the second region if a first condition is satisfied, moving the warning image to display a warning image in the first region if a second condition in which a warning level is higher than that of the first condition is satisfied after the first condition is satisfied, then updating the warning image to an updated warning image, and then moving the updated warning image to the second region.

Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

Abstract: The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.

Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

Abstract: An apparatus for transporting an electronic component includes a head for holding the component when the component is picked up from a suitable storage device. The head is movable relative to a base with an imaging apparatus being fixed to the head and allowing position of the component relative to the head to be determined while the component is being transported. A movable optical component is provided on the head which, in one position, contributes to defining an optical path between the component and the imaging apparatus, and in another position, is withdrawn. A further imaging apparatus may be provided, on the base or on the head with the further imaging apparatus detecting the position of large components, if the first imaging apparatus has a narrow filed of view for small components. Alternatively, when the further imaging apparatus is on the head, the imaging apparatus may detect the position to which the component is to be transported.

Abstract: Method and apparatus for detecting vertical and horizontal deformations of leads of a semiconductor device by illuminating the leads with a planar light beam and determining relative positions of the planar light beam on the leads on the basis of distribution of light rays reflected from the leads. Different lead deformations can be detected with one and the same mechanism within a short time. By applying the invention to a semiconductor device mounting apparatus, a single detector can be employed in common both for the detection of the semiconductor device position and the detection of reflections of the planar beam.

Abstract: An FM noise suppressor comprising a detector circuit which detects noise pulses included in a detected stereo composite signal, a gate circuit which is enabled or disabled by an output from the detector circuit, and a reproducing circuit which receives the stereo composite signal without intervention of the gate circuit and which reproduces a subcarrier signal for FM stereo signal demodulation in synchronism with a pilot signal included in the received stereo composite signal. A decoder demodulates stereo signals on the basis of an output signal of the gate circuit and the output signal of the reproducing circuit.