Patents by Inventor Makoto Hora
Makoto Hora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8835761Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.Type: GrantFiled: March 7, 2008Date of Patent: September 16, 2014Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Patent number: 8178794Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.Type: GrantFiled: March 7, 2008Date of Patent: May 15, 2012Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Patent number: 8003898Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.Type: GrantFiled: September 10, 2007Date of Patent: August 23, 2011Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Publication number: 20100212953Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.Type: ApplicationFiled: March 7, 2008Publication date: August 26, 2010Applicant: NOK CORPORATIONInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Publication number: 20100181089Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.Type: ApplicationFiled: March 7, 2008Publication date: July 22, 2010Applicant: NOK CORPORATIONInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Publication number: 20090250261Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.Type: ApplicationFiled: September 10, 2007Publication date: October 8, 2009Applicant: Nok CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Patent number: 7017885Abstract: In the region in which a coil and a connector are provided, the leakage of a fluid to which coil and connector is prevented by a seal member, a passage extending from the seal member to a position in the vicinity of a terminal of the connector is formed. At the time of completion of the production of a solenoid valve assembly, an air-tightness test on the seal member can be conducted directly through the passage, so that the detection of damage to the seal member, the detection of bite into the seal member, the detection of a defect of the seal member and so on can be carried out at the time of completion of the production of the mentioned assembly. Namely, the detection of the sealability of the seal member is rendered possible.Type: GrantFiled: March 18, 2003Date of Patent: March 28, 2006Assignee: NOK CorporationInventors: Ichiro Hirata, Kazuaki Nagayoshi, Akira Ono, Makoto Hora, Yoshinari Kasagi
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Publication number: 20040041114Abstract: In the region in which a coil and a connector are provided, the leakage of a fluid to which coil and connector is prevented by a seal member, a passage extending from the seal member to a position in the vicinity of a terminal of the connector is formed. At the time of completion of the production of a solenoid valve assembly, an air-tightness test on the seal member can be conducted directly through the passage, so that the detection of damage to, bite into and a defect of the seal member can be carried out at the time of completion of the production of the mentioned assembly. Namely, the detection of the sealability of the seal member is rendered possible.Type: ApplicationFiled: March 18, 2003Publication date: March 4, 2004Inventors: Ichiro Hirata, Kazuaki Nagayoshi, Akira Ono, Makoto Hora, Yoshinari Kasagi