Patents by Inventor Makoto Hora

Makoto Hora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8835761
    Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: September 16, 2014
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Patent number: 8178794
    Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: May 15, 2012
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Patent number: 8003898
    Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: August 23, 2011
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Publication number: 20100212953
    Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.
    Type: Application
    Filed: March 7, 2008
    Publication date: August 26, 2010
    Applicant: NOK CORPORATION
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Publication number: 20100181089
    Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.
    Type: Application
    Filed: March 7, 2008
    Publication date: July 22, 2010
    Applicant: NOK CORPORATION
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Publication number: 20090250261
    Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.
    Type: Application
    Filed: September 10, 2007
    Publication date: October 8, 2009
    Applicant: Nok Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Patent number: 7017885
    Abstract: In the region in which a coil and a connector are provided, the leakage of a fluid to which coil and connector is prevented by a seal member, a passage extending from the seal member to a position in the vicinity of a terminal of the connector is formed. At the time of completion of the production of a solenoid valve assembly, an air-tightness test on the seal member can be conducted directly through the passage, so that the detection of damage to the seal member, the detection of bite into the seal member, the detection of a defect of the seal member and so on can be carried out at the time of completion of the production of the mentioned assembly. Namely, the detection of the sealability of the seal member is rendered possible.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: March 28, 2006
    Assignee: NOK Corporation
    Inventors: Ichiro Hirata, Kazuaki Nagayoshi, Akira Ono, Makoto Hora, Yoshinari Kasagi
  • Publication number: 20040041114
    Abstract: In the region in which a coil and a connector are provided, the leakage of a fluid to which coil and connector is prevented by a seal member, a passage extending from the seal member to a position in the vicinity of a terminal of the connector is formed. At the time of completion of the production of a solenoid valve assembly, an air-tightness test on the seal member can be conducted directly through the passage, so that the detection of damage to, bite into and a defect of the seal member can be carried out at the time of completion of the production of the mentioned assembly. Namely, the detection of the sealability of the seal member is rendered possible.
    Type: Application
    Filed: March 18, 2003
    Publication date: March 4, 2004
    Inventors: Ichiro Hirata, Kazuaki Nagayoshi, Akira Ono, Makoto Hora, Yoshinari Kasagi