Abstract: A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.

Abstract: The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

Abstract: The present invention provides a method for forming a cured film of a positive type photosensitive polymer composition over a support, including: a coating step for coating the aforementioned support with the aforementioned positive type photosensitive polymer composition; an exposure step for selectively irradiating the aforementioned positive type photosensitive polymer composition with a chemical ray to achieve an exposure; a developing step for developing an exposed section of the aforementioned positive type photosensitive polymer composition with an alkaline developer solution; a rinsing process for rinsing the aforementioned developer solution off with a rinsing solution and removing the exposed section of the aforementioned positive type photosensitive polymer composition; and a curing step for heating the aforementioned positive type photosensitive polymer composition to form a cured film, wherein the aforementioned rinsing step includes a first rinsing step and a second rinsing step, the aforementio

Abstract: A method for preparing a photosensitive resin composition including at least (A) an alkali-soluble resin, (B) a photoacid generator, (C) a surfactant and (D) an organic solvent includes a step of obtaining a dispersion liquid which contains (C) the surfactant and (D) the organic solvent, and does not contain (A) the alkali-soluble resin and (B) the photoacid generator, and a step of adding (A) the alkali-soluble resin and (B) the photoacid generator to the dispersion liquid.

Abstract: A method for producing a positive-type photosensitive resin composition which includes a process of filtering the positive-type photosensitive resin composition containing a surfactant by using a filter, wherein a contact angle on one surface of the filter is equal to or more than 30 degrees and equal to or less than 80 degrees when measured using formamide.