Patents by Inventor Makoto Imahori

Makoto Imahori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240218210
    Abstract: A multilayer sheet includes: a substrate layer (A) that includes 40 to 99.9% by mass of a polyphenylene ether (a1), 0 to 59.9% by mass of a polystyrene (a2), and an amino group-containing polymer (a3); and an adhesive layer (B) that includes an acid-modified polyolefin.
    Type: Application
    Filed: April 27, 2022
    Publication date: July 4, 2024
    Inventors: Makoto IMAHORI, Kentaro MIYAMURA, Keigo IWATSUKI, Takashi TSUDA
  • Publication number: 20240010884
    Abstract: An adhesive composition includes an acid-modified polyolefin (A) that is graft-modified with 0.2 to 5 parts by mass of an acid compound (a2) with respect to 100 parts by mass of a polyolefin (a1), in which the adhesive composition has a storage modulus of from 130 to 330 MPa at 23° C. as measured by a rheometer and has a yield modulus of from 30 to 120 MPa at 23° C. in a tensile test.
    Type: Application
    Filed: September 21, 2021
    Publication date: January 11, 2024
    Inventors: Takashi TSUDA, Makoto IMAHORI
  • Publication number: 20220340781
    Abstract: The invention provides an assembly for fuel cell which has an excellent adhesive force in the presence of hot water, and a laminated body which is used for the assembly for fuel cell. The assembly for fuel cell comprises an adhesive resin layer containing a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and two or more members bonded with the adhesive resin layer interposed therebetween, wherein at least one of the members is a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.
    Type: Application
    Filed: September 10, 2020
    Publication date: October 27, 2022
    Applicants: TOYOBO CO., LTD., TOAGOSEI CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shinya WATANABE, Ai KOGANEMARU, Hisao OKUMURA, Tomoya SUGIKI, Takahiro ITO, Makoto IMAHORI, Yusuke SHIMMYO, Kenji SATO, Takuya KURIHARA
  • Publication number: 20220332980
    Abstract: The invention provides a laminated body having an excellent adhesive force with respect to a low-polarity metal member in the presence of hot water. The laminated body contains a resin substrate; an easily adhesive layer provided on at least one surface of the resin substrate; and an adhesive resin layer provided on a surface of the easily adhesive layer on a side opposite to the resin substrate, wherein the adhesive resin layer contains a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and the laminated body is used for bonding a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.
    Type: Application
    Filed: September 10, 2020
    Publication date: October 20, 2022
    Applicants: TOYOBO CO., LTD., TOAGOSEI CO., LTD.
    Inventors: Shinya WATANABE, Ai KOGANEMARU, Hisao OKUMURA, Tomoya SUGIKI, Takahiro ITO, Makoto IMAHORI
  • Publication number: 20220332984
    Abstract: An object of the present invention is to provide an adhesive composition having an excellent adhesive force even in the presence of hot water in an assembly in which at least one of two or more members to be bonded to each other via the adhesive composition is a low-polarity metal member, and an adhesion method. The present invention relates to an adhesive composition and an adhesion method for bonding a metal member. The adhesive composition contains a polyolefin (A) component having an acidic group and/or an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g. The metal member has a ratio of a dipole term in surface free energy of 0.01% to 5.0%.
    Type: Application
    Filed: September 10, 2020
    Publication date: October 20, 2022
    Applicants: TOAGOSEI CO., LTD., TOYOBO CO., LTD.
    Inventors: Tomoya SUGIKI, Takahiro ITO, Makoto IMAHORI, Shinya WATANABE, Ai KOGANEMARU, Hisao OKUMURA
  • Publication number: 20210087438
    Abstract: An adhesive composition for a battery includes an acid-modified polyolefin (A) having an acidic group and/or an acid anhydride group and having a degree of acid modification of 0.001 to 0.10 mol %, and an alkoxysilyl group-containing compound (B) in an amount of 2 to 35 parts by mass relative to 100 parts by mass of the acid-modified polyolefin (A). In the adhesive composition for a battery, the component (B) can include at least one selected from the group consisting of an alkoxysilyl group-containing polyolefin (b1), an alkoxysilyl group-containing vinyl polymer (b2), and a silane coupling agent (b3).
    Type: Application
    Filed: January 10, 2019
    Publication date: March 25, 2021
    Inventors: Tomoya SUGIKI, Takahiro ITO, Makoto IMAHORI
  • Publication number: 20200131413
    Abstract: An adhesive composition having high room-temperature peel strength, high hot peel strength, and excellent adhesion, as well as excellent electrolyte resistance even when used for packaging materials for lithium ion batteries is provided, which contains an organic solvent, a polyolefin (A) that has an acidic group and/or an acid anhydride group and is soluble in the organic solvent, and an isocyanate compound, wherein the isocyanate compound comprises (B) a diisocyanate compound having a C4-7 hydrocarbon group and/or a derivative thereof, and (C) a diisocyanate compound having a C8-14 hydrocarbon group and/or a derivative thereof; and a heat-fusible member using the adhesive composition is also provided.
    Type: Application
    Filed: June 18, 2018
    Publication date: April 30, 2020
    Inventors: Takahiro ITO, Makoto IMAHORI, Makoto HIRAKAWA
  • Publication number: 20190390093
    Abstract: The polyester-based resin composition according to the invention is a polyester resin composition, containing: at least a polyester resin (A); and a surfactant (B), in which the polyester resin (A) is a copolymer of a compound having a polyalkylene glycol with from 3 to 50 repeating units as a structure as a constituent component, the surfactant (B) is a nonionic surfactant having a structure of a polyalkylene glycol, and the contact angle of water is 30° or less.
    Type: Application
    Filed: March 14, 2017
    Publication date: December 26, 2019
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Takahiro ITO, Tatsuya NAKAYASU, Makoto IMAHORI
  • Publication number: 20190256749
    Abstract: The polyester-based resin composition according to the present invention is, at least, a polyester-based resin composition including: a polyester resin (A); a surfactant (B); and a terpene-based resin (C), in which the polyester resin (A) is obtained by copolymerizing, as a constituent component, a compound that has, as a frame, a polyalkylene glycol having a number of repeating units of from 3 to 50, in which the surfactant (B) is a non-ionic surfactant having a polyalkylene glycol frame, in which a mixing ratio (A)/(C) of the polyester resin (A) to the terpene-based resin (C) is from 80/20 to 99/1 by mass ratio, and in which the polyester-based resin composition has a water contact angle of 30° or less.
    Type: Application
    Filed: October 16, 2017
    Publication date: August 22, 2019
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Takahiro ITOU, Makoto IMAHORI
  • Patent number: 10239287
    Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: March 26, 2019
    Assignees: SHOWA DENKO PACKAGING CO., LTD., TOAGOSEI CO., LTD.
    Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
  • Patent number: 9309373
    Abstract: Provided is an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Also provided is an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: April 12, 2016
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Takahiro Ito, Makoto Imahori, Tatsuo Nishio
  • Publication number: 20150004476
    Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 1, 2015
    Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
  • Publication number: 20130338284
    Abstract: The purpose of the present invention is to provide an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Another purpose of the present invention is to provide an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.
    Type: Application
    Filed: December 2, 2011
    Publication date: December 19, 2013
    Applicant: TOAGOSEI CO LTD
    Inventors: Takahiro Ito, Makoto Imahori, Tatsuo Nishio
  • Publication number: 20090071703
    Abstract: The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 ?m or more and 10 ?m or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1?) is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C.
    Type: Application
    Filed: April 4, 2006
    Publication date: March 19, 2009
    Applicants: TOAGOSEI CO., LTD., TORAY ENGINEERING CO., LTD, KYORITSU CHEMICAL & CO., LTD.
    Inventors: Makoto Imahori, Takashi Nakaya, Masanori Akita, Kousei Nogami, Teruo Tagai